Microchip PIC18 datasheet: 28.4.3 Timing diagrams and specifications

Published by Microchip · pages 389–408 of 438 · Original PDF

63 discussions about the Microchip PIC18

All 18 parts of the datasheet

28.4.3 TIMING DIAGRAMS AND SPECIFICATIONS

FIGURE 28-5: EXTERNAL CLOCK TIMING (ALL MODES EXCEPT PLL)

Figure from the manual

TABLE 28-8: EXTERNAL CLOCK TIMING REQUIREMENTS

Param. No. Symbol Characteristic Min Max Units Conditions
1A FOSC External CLKI Frequency(1) Oscillator Frequency(1) DC 48 MHz EC, ECIO Oscillator mode
0.2 1 MHz XT, XTPLL Oscillator mode
4 25(2) MHz HS Oscillator mode
4 24(2) MHz HSPLL Oscillator mode
1 TOSC External CLKI Period(1) Oscillator Period(1) 20.8 DC ns EC, ECIO Oscillator mode
1000 5000 ns XT Oscillator mode
40 250 ns HS Oscillator mode
40 250 ns HSPLL Oscillator mode
2 TCY Instruction Cycle Time(1) 83.3 DC ns TCY = 4/FOSC
3 TosL, TosH External Clock in (OSC1) High or Low Time 30 — ns XT Oscillator mode
10 — ns HS Oscillator mode
4 TosR, TosF External Clock in (OSC1) Rise or Fall Time — 20 ns XT Oscillator mode
— 7.5 ns HS Oscillator mode

Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period for all configurations except PLL. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the “max.” cycle time limit is “DC” (no clock) for all devices.

2: When VDD >= 3.3V, the maximum crystal or resonator frequency is 25 MHz (or 24 MHz with PLL prescaler). When 2.0V < VDD < 3.3V, the maximum crystal frequency = (16.36 MHz/V)(VDD – 2.0V) + 4 MHz.

TABLE 28-9: PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0V TO 5.5V)

Param No. Sym Characteristic Min Typ† Max Units Conditions
F10 FOSC Oscillator Frequency Range 4 — 48 MHz With PLL prescaler
F11 FSYS On-Chip VCO System Frequency — 96 — MHz
F12 t_rc PLL Start-up Time (Lock Time) — — 2 ms
F13 ΔCLK CLKO Stability (Jitter) -0.25 — +0.25 %

† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.

TABLE 28-10: AC CHARACTERISTICS: INTERNAL RC ACCURACY

PIC18F2455/2550/4455/4550 (INDUSTRIAL)
PIC18LF2455/2550/4455/4550 (INDUSTRIAL)

PIC18LF2455/2550/4455/4550 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial
PIC18F2455/2550/4455/4550 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial
Param No. Device Min Typ Max Units Conditions
INTOSC Accuracy @ Freq = 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz(1)
F14 PIC18LF2455/2550/4455/4550 -2 +/-1 2 % +25°C VDD = 2.7-3.3V
F15 -5 — 5 % -10°C to +85°C VDD = 2.7-3.3V
F16 -10 +/-1 10 % -40°C to +85°C VDD = 2.7-3.3V
F17 PIC18F2455/2550/4455/4550 -2 +/-1 2 % +25°C VDD = 4.5-5.5V
F18 -5 — 5 % -10°C to +85°C VDD = 4.5-5.5V
F19 -10 +/-1 10 % -40°C to +85°C VDD = 4.5-5.5V
INTRC Accuracy @ Freq = 31 kHz(2)
F20 PIC18LF2455/2550/4455/4550 26.562 — 35.938 kHz -40°C to +85°C VDD = 2.7-3.3V
F21 PIC18F2455/2550/4455/4550 26.562 — 35.938 kHz -40°C to +85°C VDD = 4.5-5.5V

Legend: Shading of rows is to assist in readability of the table.
Note 1: Frequency calibrated at 25°C. OSCTUNE register can be used to compensate for temperature drift.
2: INTRC frequency after calibration.
3: Change of INTRC frequency as VDD changes.

FIGURE 28-6: CLKO AND I/O TIMING

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-11: CLKO AND I/O TIMING REQUIREMENTS

Param No. Symbol Characteristic Min Typ Max Units Conditions
10 TosH2ckL OSC1 ↑ to CLKO ↓ — 75 200 ns (Note 1)
11 TosH2ckH OSC1 ↑ to CLKO ↑ — 75 200 ns (Note 1)
12 TckR CLKO Rise Time — 35 100 ns (Note 1)
13 TckF CLKO Fall Time — 35 100 ns (Note 1)
14 TckL2ioV CLKO ↓ to Port Out Valid — — 0.5 TCY + 20 ns (Note 1)
15 TioV2ckH Port In Valid before CLKO ↑ 0.25 TCY + 25 — — ns (Note 1)
16 TckH2ioI Port In Hold after CLKO ↑ 0 — — ns (Note 1)
17 TosH2ioV OSC1 ↑ (Q1 cycle) to Port Out Valid — 50 150 ns
18 TosH2ioI OSC1 ↑ (Q2 cycle) to Port Input Invalid (I/O in hold time) PIC18FXXXX 100 — ns
18A PIC18LFXXXX 200 — ns VDD = 2.0V
19 TioV2osH Port Input Valid to OSC1 ↑ (I/O in setup time) 0 — — ns
20 TioR Port Output Rise Time PIC18FXXXX — 10 25 ns
20A PIC18LFXXXX — — 60 ns VDD = 2.0V
21 TioF Port Output Fall Time PIC18FXXXX — 10 25 ns
21A PIC18LFXXXX — — 60 ns VDD = 2.0V
22† TINP INTx pin High or Low Time TCY — — ns
23† TRBP RB7:RB4 Change INTx High or Low Time TCY — — ns

† These parameters are asynchronous events not related to any internal clock edges.

Note 1: Measurements are taken in RC mode, where CLKO output is 4 x TOSC.

FIGURE 28-7: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

FIGURE 28-8: BROWN-OUT RESET TIMING

Figure from the manual

TABLE 28-12: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET REQUIREMENTS

Param. No. Symbol Characteristic Min Typ Max Units Conditions
30 TmCL MCLR Pulse Width (low) 2 — — µs
31 TWDT Watchdog Timer Time-out Period (no postscaler) 3.5 4.1 4.8 ms
32 TOST Oscillator Start-up Timer Period 1024 TOSC — 1024 TOSC — TOSC = OSC1 period
33 TPWRT Power-up Timer Period 57.0 65.5 77.1 ms
34 TIOZ I/O High-Impedance from MCLR Low or Watchdog Timer Reset — 2 — µs
35 TBOR Brown-out Reset Pulse Width 200 — — µs VDD ≤ BVDD (see D005)
36 TIRVST Time for Internal Reference Voltage to become Stable — 20 50 µs
37 TLVD Low-Voltage Detect Pulse Width 200 — — µs VDD ≤ VLVD
38 TCSD CPU Start-up Time 5 — 10 µs
39 TIOBST Time for INTOSC to Stabilize — 1 — ms

FIGURE 28-9: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-13: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS

Param No. Symbol Characteristic Min Max Units Conditions
40 Tt0H T0CKI High Pulse Width No prescaler 0.5 TCY + 20 — ns
With prescaler 10 — ns
41 Tt0L T0CKI Low Pulse Width No prescaler 0.5 TCY + 20 — ns
With prescaler 10 — ns
42 Tt0P T0CKI Period No prescaler TCY + 10 — ns
With prescaler Greater of: 20 ns or (TCY + 40)/N — ns N = prescale value (1, 2, 4,..., 256)
45 Tt1H T13CKI High Time Synchronous, no prescaler 0.5 TCY + 20 — ns
Synchronous, with prescaler PIC18FXXXX 10 — ns
PIC18LFXXXX 25 — ns VDD = 2.0V
Asynchronous PIC18FXXXX 30 — ns
PIC18LFXXXX 50 — ns VDD = 2.0V
46 Tt1L T13CKI Low Time Synchronous, no prescaler 0.5 TCY + 5 — ns
Synchronous, with prescaler PIC18FXXXX 10 — ns
PIC18LFXXXX 25 — ns VDD = 2.0V
Asynchronous PIC18FXXXX 30 — ns
PIC18LFXXXX 50 — ns VDD = 2.0V
47 Tt1P T13CKI Input Period Synchronous Greater of: 20 ns or (TCY + 40)/N — ns N = prescale value (1, 2, 4, 8)
Asynchronous 60 — ns
Ft1 T13CKI Oscillator Input Frequency Range DC 50 kHz
48 Tcke2tmrl Delay from External T13CKI Clock Edge to Timer Increment 2 TOSC 7 TOSC —

FIGURE 28-10: CAPTURE/COMPARE/PWM TIMINGS (ALL CCP MODULES)

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-14: CAPTURE/COMPARE/PWM REQUIREMENTS (ALL CCP MODULES)

FIGURE 28-11: EXAMPLE SPI MASTER MODE TIMING (CKE = 0)

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-15: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0)

Param No. Symbol Characteristic Min Max Units Conditions
70 TssL2scH, TssL2scL SS ↓ to SCK ↓ or SCK ↑ Input 3 TCY — ns
71 TscH SCK Input High Time (Slave mode) Continuous 1.25 TCY + 30 — ns
71A Single Byte 40 — ns (Note 1)
72 TscL SCK Input Low Time (Slave mode) Continuous 1.25 TCY + 30 — ns
72A Single Byte 40 — ns (Note 1)
73 TdiV2scH, TdiV2scL Setup Time of SDI Data Input to SCK Edge 20 — ns
73A Tb2b Last Clock Edge of Byte 1 to the 1st Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2)
74 TscH2diL, TscL2diL Hold Time of SDI Data Input to SCK Edge 35 — ns
75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns
PIC18LFXXXX — 45 ns VDD = 2.0V
76 TdoF SDO Data Output Fall Time — 25 ns
78 TscR SCK Output Rise Time (Master mode) PIC18FXXXX — 25 ns
PIC18LFXXXX — 45 ns VDD = 2.0V
79 TscF SCK Output Fall Time (Master mode) — 25 ns
80 TscH2doV, TscL2doV SDO Data Output Valid after SCK Edge PIC18FXXXX — 50 ns
PIC18LFXXXX — 100 ns VDD = 2.0V

Note 1: Requires the use of Parameter 73A. Note 2: Only if Parameter 71A and 72A are used.

FIGURE 28-12: EXAMPLE SPI MASTER MODE TIMING (CKE = 1)

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-16: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 1)

Param. No. Symbol Characteristic Min Max Units Conditions
71 TscH SCK Input High Time (Slave mode) Continuous 1.25 TCY + 30 — ns
71A Single Byte 40 — ns (Note 1)
72 TscL SCK Input Low Time (Slave mode) Continuous 1.25 TCY + 30 — ns
72A Single Byte 40 — ns (Note 1)
73 TdiV2scH, TdiV2scL Setup Time of SDI Data Input to SCK Edge 20 — ns
73A Tb2b Last Clock Edge of Byte 1 to the 1st Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2)
74 TscH2diL, TscL2diL Hold Time of SDI Data Input to SCK Edge 35 — ns
75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns
PIC18LFXXXX — 45 ns VDD = 2.0V
76 TdoF SDO Data Output Fall Time — 25 ns
78 TscR SCK Output Rise Time (Master mode) PIC18FXXXX — 25 ns
PIC18LFXXXX — 45 ns VDD = 2.0V
79 TscF SCK Output Fall Time (Master mode) — 25 ns
80 TscH2doV, TscL2doV SDO Data Output Valid after SCK Edge PIC18FXXXX — 50 ns
PIC18LFXXXX — 100 ns VDD = 2.0V
81 TdoV2scH, TdoV2scL SDO Data Output Setup to SCK Edge TCY — ns

Note 1: Requires the use of Parameter 73A. Note 2: Only if Parameter 71A and 72A are used.

FIGURE 28-13: EXAMPLE SPI SLAVE MODE TIMING (CKE = 0)

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-17: EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING, CKE = 0)

Param No. Symbol Characteristic Min Max Units Conditions
70 TssL2scH, TssL2scL SS ↓ to SCK ↓ or SCK ↑ Input 3 TCY — ns
71 TscH SCK Input High Time (Slave mode) Continuous 1.25 TCY + 30 — ns
71A Single Byte 40 — ns (Note 1)
72 TscL SCK Input Low Time (Slave mode) Continuous 1.25 TCY + 30 — ns
72A Single Byte 40 — ns (Note 1)
73 TdiV2scH, TdiV2scL Setup Time of SDI Data Input to SCK Edge 20 — ns
73A Tb2b Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2)
74 TscH2diL, TscL2diL Hold Time of SDI Data Input to SCK Edge 35 — ns
75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns
PIC18LFXXXX — 45 ns VDD = 2.0V
76 TdoF SDO Data Output Fall Time — 25 ns
77 TssH2doZ SS ↑ to SDO Output High-Impedance 10 50 ns
78 TscR SCK Output Rise Time (Master mode) PIC18FXXXX — 25 ns
PIC18LFXXXX — 45 ns VDD = 2.0V
79 TscF SCK Output Fall Time (Master mode) — 25 ns
80 TscH2doV, TscL2doV SDO Data Output Valid after SCK Edge PIC18FXXXX — 50 ns
PIC18LFXXXX — 100 ns VDD = 2.0V
83 TscH2ssH, TscL2ssH SS ↑ after SCK edge 1.5 TCY + 40 — ns

Note 1: Requires the use of Parameter 73A. Note 2: Only if Parameter 71A and 72A are used.

FIGURE 28-14: EXAMPLE SPI SLAVE MODE TIMING (CKE = 1)

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-18: EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1)

Param No. Symbol Characteristic Min Max Units Conditions
70 TssL2scH, TssL2scL SS ↓ to SCK ↓ or SCK ↑ Input 3 TCY — ns
71 TscH SCK Input High Time (Slave mode) Continuous 1.25 TCY + 30 — ns
71A Single Byte 40 — ns (Note 1)
72 TscL SCK Input Low Time (Slave mode) Continuous 1.25 TCY + 30 — ns
72A Single Byte 40 — ns (Note 1)
73A Tb2b Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2)
74 TscH2diL, TscL2diL Hold Time of SDI Data Input to SCK Edge 35 — ns
75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns
PIC18LFXXXX — 45 ns VDD = 2.0V
76 TdoF SDO Data Output Fall Time — 25 ns
77 TssH2doZ SS ↑ to SDO Output High-Impedance 10 50 ns
78 TscR SCK Output Rise Time (Master mode) PIC18FXXXX — 25 ns
PIC18LFXXXX — 45 ns VDD = 2.0V
79 TscF SCK Output Fall Time (Master mode) — 25 ns
80 TscH2doV, TscL2doV SDO Data Output Valid after SCK Edge PIC18FXXXX — 50 ns
PIC18LFXXXX — 100 ns VDD = 2.0V
82 TssL2doV SDO Data Output Valid after SS ↓ Edge PIC18FXXXX — 50 ns
PIC18LFXXXX — 100 ns VDD = 2.0V
83 TscH2ssH, TscL2ssH SS ↑ after SCK Edge 1.5 TCY + 40 — ns

Note 1: Requires the use of Parameter 73A. Note 2: Only if Parameter 71A and 72A are used.

FIGURE 28-15: I²C™ BUS START/STOP BITS TIMING

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-19: I²C™ BUS START/STOP BITS REQUIREMENTS (SLAVE MODE)

Param. No. Symbol Characteristic Min Max Units Conditions
90 TSU:STA Start Condition Setup Time 100 kHz mode 4700 — ns Only relevant for Repeated Start condition
400 kHz mode 600 —
91 THD:STA Start Condition Hold Time 100 kHz mode 4000 — ns After this period, the first clock pulse is generated
400 kHz mode 600 —
92 TSU:STO Stop Condition Setup Time 100 kHz mode 4700 — ns
400 kHz mode 600 —
93 THD:STO Stop Condition Hold Time 100 kHz mode 4000 — ns
400 kHz mode 600 —

FIGURE 28-16: I²C™ BUS DATA TIMING

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-20: I²C™ BUS DATA REQUIREMENTS (SLAVE MODE)

Param. No. Symbol Characteristic Min Max Units Conditions
100 THIGH Clock High Time 100 kHz mode 4.0 — μs PIC18FXXXX must operate at a minimum of 1.5 MHz
400 kHz mode 0.6 — μs PIC18FXXXX must operate at a minimum of 10 MHz
MSSP Module 1.5 TCY —
101 TLOW Clock Low Time 100 kHz mode 4.7 — μs PIC18FXXXX must operate at a minimum of 1.5 MHz
400 kHz mode 1.3 — μs PIC18FXXXX must operate at a minimum of 10 MHz
MSSP Module 1.5 TCY —
102 TR SDA and SCL Rise Time 100 kHz mode — 1000 ns
400 kHz mode 20 + 0.1 CB 300 ns CB is specified to be from 10 to 400 pF
103 TF SDA and SCL Fall Time 100 kHz mode — 300 ns
400 kHz mode 20 + 0.1 CB 300 ns CB is specified to be from 10 to 400 pF
90 TSU:STA Start Condition Setup Time 100 kHz mode 4.7 — μs Only relevant for Repeated Start condition
400 kHz mode 0.6 — μs
91 THD:STA Start Condition Hold Time 100 kHz mode 4.0 — μs After this period, the first clock pulse is generated
400 kHz mode 0.6 — μs
106 THD:DAT Data Input Hold Time 100 kHz mode 0 — ns
400 kHz mode 0 0.9 μs
107 TSU:DAT Data Input Setup Time 100 kHz mode 250 — ns (Note 2)
400 kHz mode 100 — ns
92 TSU:STO Stop Condition Setup Time 100 kHz mode 4.7 — μs
400 kHz mode 0.6 — μs
109 TAA Output Valid from Clock 100 kHz mode — 3500 ns (Note 1)
400 kHz mode — — ns
110 TBUF Bus Free Time 100 kHz mode 4.7 — μs Time the bus must be free before a new transmission can start
400 kHz mode 1.3 — μs
D102 CB Bus Capacitive Loading — 400 pF

Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

2: A Fast mode I²C™ bus device can be used in a Standard mode I²C bus system but the requirement, TSU:DAT ≥ 250 ns, must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line, TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the Standard mode I²C bus specification), before the SCL line is released.

FIGURE 28-17: MASTER SSP I²C™ BUS START/STOP BITS TIMING WAVEFORMS

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-21: MASTER SSP I²C™ BUS START/STOP BITS REQUIREMENTS

Param. No. Symbol Characteristic Min Max Units Conditions
90 TSU:STA Start Condition Setup Time 100 kHz mode 2(TOSC)(BRG + 1) — ns Only relevant for Repeated Start condition
400 kHz mode 2(TOSC)(BRG + 1) —
1 MHz mode(1) 2(TOSC)(BRG + 1) —
91 THD:STA Start Condition Hold Time 100 kHz mode 2(TOSC)(BRG + 1) — ns After this period, the first clock pulse is generated
400 kHz mode 2(TOSC)(BRG + 1) —
1 MHz mode(1) 2(TOSC)(BRG + 1) —
92 TSU:STO Stop Condition Setup Time 100 kHz mode 2(TOSC)(BRG + 1) — ns
400 kHz mode 2(TOSC)(BRG + 1) —
1 MHz mode(1) 2(TOSC)(BRG + 1) —
93 THD:STO Stop Condition Hold Time 100 kHz mode 2(TOSC)(BRG + 1) — ns
400 kHz mode 2(TOSC)(BRG + 1) —
1 MHz mode(1) 2(TOSC)(BRG + 1) —

Note 1: Maximum pin capacitance = 10 pF for all I²C™ pins.

FIGURE 28-18: MASTER SSP I²C™ BUS DATA TIMING

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-22: MASTER SSP I²C™ BUS DATA REQUIREMENTS

Param. No. Symbol Characteristic Min Max Units Conditions
100 THIGH Clock High Time 100 kHz mode 2(TOSC)(BRG + 1) — ms
400 kHz mode 2(TOSC)(BRG + 1) — ms
1 MHz mode(1) 2(TOSC)(BRG + 1) — ms
101 TLOW Clock Low Time 100 kHz mode 2(TOSC)(BRG + 1) — ms
400 kHz mode 2(TOSC)(BRG + 1) — ms
1 MHz mode(1) 2(TOSC)(BRG + 1) — ms
102 TR SDA and SCL Rise Time 100 kHz mode — 1000 ns CB is specified to be from 10 to 400 pF
400 kHz mode 20 + 0.1 CB 300 ns
1 MHz mode(1) — 300 ns
103 TF SDA and SCL Fall Time 100 kHz mode — 300 ns CB is specified to be from 10 to 400 pF
400 kHz mode 20 + 0.1 CB 300 ns
1 MHz mode(1) — 100 ns
90 TSU:STA Start Condition Setup Time 100 kHz mode 2(TOSC)(BRG + 1) — ms Only relevant for Repeated Start condition
400 kHz mode 2(TOSC)(BRG + 1) — ms
1 MHz mode(1) 2(TOSC)(BRG + 1) — ms
91 THD:STA Start Condition Hold Time 100 kHz mode 2(TOSC)(BRG + 1) — ms After this period, the first clock pulse is generated
400 kHz mode 2(TOSC)(BRG + 1) — ms
1 MHz mode(1) 2(TOSC)(BRG + 1) — ms
106 THD:DAT Data Input Hold Time 100 kHz mode 0 — ns
400 kHz mode 0 0.9 ms
107 TSU:DAT Data Input Setup Time 100 kHz mode 250 — ns (Note 2)
400 kHz mode 100 — ns
92 TSU:STO Stop Condition Setup Time 100 kHz mode 2(TOSC)(BRG + 1) — ms
400 kHz mode 2(TOSC)(BRG + 1) — ms
1 MHz mode(1) 2(TOSC)(BRG + 1) — ms
109 TAA Output Valid from Clock 100 kHz mode — 3500 ns
400 kHz mode — 1000 ns
1 MHz mode(1) — — ns
110 TBUF Bus Free Time 100 kHz mode 4.7 — ms Time the bus must be free before a new transmission can start
400 kHz mode 1.3 — ms
D102 CB Bus Capacitive Loading — 400 pF

Note 1: Maximum pin capacitance = 10 pF for all I²C™ pins.

2: A Fast mode I²C bus device can be used in a Standard mode I²C bus system but parameter #107 ≥ 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line, parameter #102 + parameter #107 = 1000 + 250 = 1250 ns (for 100 kHz mode), before the SCL line is released.

FIGURE 28-19: EUSART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-23: EUSART SYNCHRONOUS TRANSMISSION REQUIREMENTS

Param No. Symbol Characteristic Min Max Units Conditions
120 TckH2dtV SYNC XMIT (MASTER & SLAVE) Clock High to Data Out Valid — 40 ns
PIC18FXXXX — 40 ns
PIC18LFXXXX — 100 ns VDD = 2.0V
121 Tckrf Clock Out Rise Time and Fall Time (Master mode) PIC18FXXXX — 20 ns
PIC18LFXXXX — 50 ns VDD = 2.0V
122 Tdtrf Data Out Rise Time and Fall Time PIC18FXXXX — 20 ns
PIC18LFXXXX — 50 ns VDD = 2.0V

FIGURE 28-20: EUSART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-24: EUSART SYNCHRONOUS RECEIVE REQUIREMENTS

Param. No. Symbol Characteristic Min Max Units Conditions
125 TDtV2cKL SYNC RCV (MASTER & SLAVE) Data Hold before CK ↓ (DT hold time) 10 — ns
126 TcKL2DTL Data Hold after CK ↓ (DT hold time) 15 — ns

FIGURE 28-21: USB SIGNAL TIMING

Figure from the manual

TABLE 28-25: USB LOW-SPEED TIMING REQUIREMENTS

Param No. Symbol Characteristic Min Typ Max Units Conditions
T01 TLR Transition Rise Time 75 — 300 ns CL = 200 to 600 pF
T02 TLF Transition Fall Time 75 — 300 ns CL = 200 to 600 pF
T03 TLRFM Rise/Fall Time Matching 80 — 125 %

TABLE 28-26: USB FULL-SPEED REQUIREMENTS

Param No. Symbol Characteristic Min Typ Max Units Conditions
T04 TFR Transition Rise Time 4 — 20 ns CL = 50 pF
T05 TFF Transition Fall Time 4 — 20 ns CL = 50 pF
T06 TFRFM Rise/Fall Time Matching 90 — 111.1 %

FIGURE 28-22: STREAMING PARALLEL PORT TIMING (PIC18F4455/4550)

Figure from the manual

Note: Refer to Figure 28-4 for load conditions.

TABLE 28-27: STREAMING PARALLEL PORT REQUIREMENTS (PIC18F4455/4550)

Param. No. Symbol Characteristic Min Max Units Conditions
T07 ToeF2adR OESPP Falling Edge to CSSPP Rising Edge, Address Out 0 5 ns
T08 ToeF2adV OESPP Falling Edge to Address Out Valid 0 5 ns
T09 ToeR2adl OESPP Rising Edge to Address Out Invalid 0 5 ns
T10 ToeF2daR OESPP Falling Edge to CSSPP Rising Edge, Data Out 0 5 ns
T11 ToeF2daV OESPP Falling Edge to Address Out Valid 0 5 ns
T12 ToeR2dal OESPP Rising Edge to Data Out Invalid 0 5 ns

TABLE 28-28: A/D CONVERTER CHARACTERISTICS: PIC18F2455/2550/4455/4550 (INDUSTRIAL) PIC18LF2455/2550/4455/4550 (INDUSTRIAL)

Param No. Symbol Characteristic Min Typ Max Units Conditions
A01 NR Resolution — — 10 bit ΔVREF ≥ 3.0V
A03 EIL Integral Linearity Error — — <±1 LSB ΔVREF ≥ 3.0V
A04 EDL Differential Linearity Error — — <±1 LSB ΔVREF ≥ 3.0V
A06 EOFF Offset Error — — <±2.0 LSB ΔVREF ≥ 3.0V
A07 EGN Gain Error — — <±1 LSB ΔVREF ≥ 3.0V
A10 — Monotonicity Guaranteed(1) — — — VSS ≤ VAIN ≤ VREF
A20 ΔVREF Reference Voltage Range (VREFH – VREFL) 1.83.0 —— VDD – VSSVDD – VSS VV VDD < 3.0VVDD ≥ 3.0V
A21 VREFH Reference Voltage High Vss + ΔVREF — VDD V
A22 VREFL Reference Voltage Low VSS — VDD - ΔVREF V
A25 VAIN Analog Input Voltage VREFL — VREFH V
A30 ZAIN Recommended Impedance of Analog Voltage Source — — 2.5 kΩ
A50 IREF VREF Input Current(2) —— —— 5150 μAμA During VAIN acquisition.During A/D conversion cycle.

Note 1: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes.

2: VREFH current is from RA3/AN3/VREF+ pin or VDD, whichever is selected as the VREFH source. VREFL current is from RA2/AN2/VREF-/CVREF pin or VSS, whichever is selected as the VREFL source.

FIGURE 28-23: A/D CONVERSION TIMING

Figure from the manual

Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed.

2: This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input.

TABLE 28-29: A/D CONVERSION REQUIREMENTS

Param No. Symbol Characteristic Min Max Units Conditions
130 TAD A/D Clock Period PIC18FXXXX 0.8 25.0(1) μs TOSC based, VREF ≥ 3.0V
PIC18LFXXXX 1.4 25.0(1) μs VDD = 2.0V, TOSC based, VREF full range
PIC18FXXXX — 1 μs A/D RC mode
PIC18LFXXXX — 3 μs VDD = 2.0V, A/D RC mode
131 TCNV Conversion Time (not including acquisition time)(2) 11 12 TAD
132 TACQ Acquisition Time(3) 1.4 — μs -40°C to +85°C
135 TSWC Switching Time from Convert → Sample — (Note 4)
137 TDIS Discharge Time 0.2 — μs

Note 1: The time of the A/D clock period is dependent on the device frequency and the TAD clock divider.
2: ADRES registers may be read on the following TCY cycle.
3: The time for the holding capacitor to acquire the “New” input voltage when the voltage changes full scale after the conversion (VSS to VDD). The source impedance (RS) on the input channels is 50Ω.
4: On the following cycle of the device clock.

NOTES:

Text converted from the manufacturer's document. A □ marks a character that could not be read in the original. Back to the Microchip PIC18 discussions