Microchip PIC18 datasheet: 27.0 Development support

27.0 DEVELOPMENT SUPPORT

The PIC® microcontrollers are supported with a full range of hardware and software development tools:

• Integrated Development Environment
  • MPLAB® IDE Software
• Assemblers/Compilers/Linkers
  • MPASM™ Assembler
  • MPLAB C18 and MPLAB C30 C Compilers
  • MPLINK™ Object Linker/ MPLIB™ Object Librarian
  • MPLAB ASM30 Assembler/Linker/Library
• Simulators
  • MPLAB SIM Software Simulator
• Emulators
  • MPLAB ICE 2000 In-Circuit Emulator
  • MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debugger
  • MPLAB ICD 2
• Device Programmers
  • PICSTART® Plus Development Programmer
  • MPLAB PM3 Device Programmer
  • PICkit™ 2 Development Programmer
• Low-Cost Demonstration and Development Boards and Evaluation Kits

27.1 MPLAB Integrated Development Environment Software

The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains:

• A single graphical interface to all debugging tools
  • Simulator
  • Programmer (sold separately)
  • Emulator (sold separately)
  • In-Circuit Debugger (sold separately)
• A full-featured editor with color-coded context
• A multiple project manager
• Customizable data windows with direct edit of contents
• High-level source code debugging
• Visual device initializer for easy register initialization
• Mouse over variable inspection
• Drag and drop variables from source to watch windows
• Extensive on-line help
• Integration of select third party tools, such as HI-TECH Software C Compilers and IAR C Compilers

The MPLAB IDE allows you to:

• Edit your source files (either assembly or C)
• One touch assemble (or compile) and download to PIC MCU emulator and simulator tools (automatically updates all project information)
• Debug using:
  • Source files (assembly or C)
  • Mixed assembly and C
  • Machine code

MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power.

27.2 MPASM Assembler

The MPASM Assembler is a full-featured, universal macro assembler for all PIC MCUs.

The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging.

The MPASM Assembler features include:

• Integration into MPLAB IDE projects
• User-defined macros to streamline assembly code
• Conditional assembly for multi-purpose source files
• Directives that allow complete control over the assembly process

27.3 MPLAB C18 and MPLAB C30 C Compilers

The MPLAB C18 and MPLAB C30 Code Development Systems are complete ANSI C compilers for Microchip’s PIC18 and PIC24 families of microcontrollers and the dsPIC30 and dsPIC33 family of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers.

For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger.

27.4 MPLINK Object Linker/ MPLIB Object Librarian

The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script.

The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications.

The object linker/library features include:

• Efficient linking of single libraries instead of many smaller files
• Enhanced code maintainability by grouping related modules together
• Flexible creation of libraries with easy module listing, replacement, deletion and extraction

27.5 MPLAB ASM30 Assembler, Linker and Librarian

MPLAB ASM30 Assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include:

• Support for the entire dsPIC30F instruction set
• Support for fixed-point and floating-point data
• Command line interface
• Rich directive set
• Flexible macro language
• MPLAB IDE compatibility

27.6 MPLAB SIM Software Simulator

The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers.

The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C18 and MPLAB C30 C Compilers, and the MPASM and MPLAB ASM30 Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool.

27.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator

The MPLAB ICE 2000 In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000 In-Circuit Emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment.

The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The architecture of the MPLAB ICE 2000 In-Circuit Emulator allows expansion to support new PIC microcontrollers.

The MPLAB ICE 2000 In-Circuit Emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows® 32-bit operating system were chosen to best make these features available in a simple, unified application.

27.8 MPLAB REAL ICE In-Circuit Emulator System

MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC® Flash MCUs and dsPIC® Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit.

The MPLAB REAL ICE probe is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with the popular MPLAB ICD 2 system (RJ11) or with the new high-speed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5).

MPLAB REAL ICE is field upgradeable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added, such as software breakpoints and assembly code trace. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, real-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables.

27.9 MPLAB ICD 2 In-Circuit Debugger

Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low-cost, run-time development tool, connecting to the host PC via an RS-232 or high-speed USB interface. This tool is based on the Flash PIC MCUs and can be used to develop for these and other PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the Flash devices. This feature, along with Microchip’s In-Circuit Serial Programming™ (ICSP™) protocol, offers cost-effective, in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single stepping and watching variables, and CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real time. MPLAB ICD 2 also serves as a development programmer for selected PIC devices.

27.10 MPLAB PM3 Device Programmer

The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an SD/MMC card for file storage and secure data applications.

27.11 PICSTART Plus Development Programmer

The PICSTART Plus Development Programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus Development Programmer supports most PIC devices in DIP packages up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus Development Programmer is CE compliant.

27.12 PICkit 2 Development Programmer

The PICkit™ 2 Development Programmer is a low-cost programmer and selected Flash device debugger with an easy-to-use interface for programming many of Microchip’s baseline, mid-range and PIC18F families of Flash memory microcontrollers. The PICkit 2 Starter Kit includes a prototyping development board, twelve sequential lessons, software and HI-TECH’s PICC™ Lite C compiler, and is designed to help get up to speed quickly using PIC® microcontrollers. The kit provides everything needed to program, evaluate and develop applications using Microchip’s powerful, mid-range Flash memory family of microcontrollers.

27.13 Demonstration, Development and Evaluation Boards

A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification.

The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory.

The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications.

In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more.

Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits.

28.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings(t)

• Ambient temperature under bias ........ -40°C to +85°C
• Storage temperature ........ -65°C to +150°C
• Voltage on any pin with respect to VSS (except VDD and \overlineMCLR) (Note 3) ........ -0.3V to (VDD + 0.3V)
• Voltage on VDD with respect to VSS ........ -0.3V to +7.5V
• Voltage on \overlineMCLR with respect to VSS (Note 2) ........ 0V to +13.25V
• Total power dissipation (Note 1) ........ 1.0W
• Maximum current out of VSS pin ........ 300 mA
• Maximum current into VDD pin ........ 250 mA
• Input clamp current, IIK (VI < 0 or VI > VDD) ........ ±20 mA
• Output clamp current, IOK (VO < 0 or VO > VDD) ........ ±20 mA
• Maximum output current sunk by any I/O pin ........ 25 mA
• Maximum output current sourced by any I/O pin ........ 25 mA
• Maximum current sunk by all ports ........ 200 mA
• Maximum current sourced by all ports ........ 200 mA

Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD – \Sigma IOH} + \Sigma {(VDD – VOH) x IOH} + \Sigma(VOL x IOL) 2: Voltage spikes below VSS at the \overlineMCLR/VPP/RE3 pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100\Omega should be used when applying a “low” level to the \overlineMCLR/VPP/RE3 pin, rather than pulling this pin directly to VSS. 3: When the internal USB regulator is enabled or VUSB is powered externally, RC4 and RC5 are limited to -0.3V to (VUSB + 0.3V) with respect to VSS.

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

FIGURE 28-1: PIC18F2455/2550/4455/4550 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)

FIGURE 28-2: PIC18LF2455/2550/4455/4550 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL LOW VOLTAGE)

Note 1: VDDAPPMIN is the minimum voltage of the PIC® device in the application. 2: For 2.0 ≤ VDD < 4.2 V, FMAX = (16.36 MHz/V) (VDDAPPMIN - 2.0V) + 4 MHz 3: For VDD ≥ 4.2 V, FMAX = 48 MHz.

DS39632E-page 368 © 2009 Microchip Technology Inc.

28.1 DC Characteristics: Supply Voltage

PIC18F2455/2550/4455/4550 (Industrial)
PIC18LF2455/2550/4455/4550 (Industrial)

Legend: Shading of rows is to assist in readability of the table.
Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data.
Note 2: The stated minimums apply for the PIC18LF products in this device family. PIC18F products in this device family are rated for 4.2V minimum in all oscillator modes.

28.2 DC Characteristics: Power-Down and Supply Current

PIC18F2455/2550/4455/4550 (Industrial)
PIC18LF2455/2550/4455/4550 (Industrial)

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
MCLR = VDD; WDT enabled/disabled as specified.

3: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost.

4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications.

28.2 DC Characteristics: Power-Down and Supply Current

PIC18F2455/2550/4455/4550 (Industrial)
PIC18LF2455/2550/4455/4550 (Industrial) (Continued)

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
MCLR = VDD; WDT enabled/disabled as specified.

3: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost.

4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications.

28.2 DC Characteristics: Power-Down and Supply Current

PIC18F2455/2550/4455/4550 (Industrial)
PIC18LF2455/2550/4455/4550 (Industrial) (Continued)

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
MCLR = VDD; WDT enabled/disabled as specified.

3: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost.

4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications.

28.2 DC Characteristics: Power-Down and Supply Current

PIC18F2455/2550/4455/4550 (Industrial)
PIC18LF2455/2550/4455/4550 (Industrial) (Continued)

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

• OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
• MCLR = VDD; WDT enabled/disabled as specified.

3: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost.

4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications.

28.2 DC Characteristics: Power-Down and Supply Current

PIC18F2455/2550/4455/4550 (Industrial)
PIC18LF2455/2550/4455/4550 (Industrial) (Continued)

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
MCLR = VDD; WDT enabled/disabled as specified.

3: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost.

4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications.

DS39632E-page 374 © 2009 Microchip Technology Inc.

28.2 DC Characteristics: Power-Down and Supply Current

PIC18F2455/2550/4455/4550 (Industrial)
PIC18LF2455/2550/4455/4550 (Industrial) (Continued)

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
 OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
 MCLR = VDD; WDT enabled/disabled as specified.

3: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost.

4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications.

28.2 DC Characteristics: Power-Down and Supply Current

PIC18F2455/2550/4455/4550 (Industrial)
PIC18LF2455/2550/4455/4550 (Industrial) (Continued)

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
MCLR = VDD; WDT enabled/disabled as specified.

3: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost.

4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications.

28.2 DC Characteristics: Power-Down and Supply Current

PIC18F2455/2550/4455/4550 (Industrial)
PIC18LF2455/2550/4455/4550 (Industrial) (Continued)

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
  OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
  MCLR = VDD; WDT enabled/disabled as specified.

3: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost.

4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications.

28.2 DC Characteristics: Power-Down and Supply Current

PIC18F2455/2550/4455/4550 (Industrial)
PIC18LF2455/2550/4455/4550 (Industrial) (Continued)

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:
  OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
  MCLR = VDD; WDT enabled/disabled as specified.

3: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost.

4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications.

DS39632E-page 378 © 2009 Microchip Technology Inc.

28.3 DC Characteristics: PIC18F2455/2550/4455/4550 (Industrial) PIC18LF2455/2550/4455/4550 (Industrial)

Note 1: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages.

2: Negative current is defined as current sourced by the pin.

3: Parameter is characterized but not tested.

28.3 DC Characteristics: PIC18F2455/2550/4455/4550 (Industrial)

PIC18LF2455/2550/4455/4550 (Industrial) (Continued)

Note 1: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages.
2: Negative current is defined as current sourced by the pin.
3: Parameter is characterized but not tested.

TABLE 28-1: MEMORY PROGRAMMING REQUIREMENTS

† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.

Note 1: These specifications are for programming the on-chip program memory through the use of table write instructions.

2: Refer to Section 7.7 “Using the Data EEPROM” for a more detailed discussion on data EEPROM endurance.

3: Required only if Single-Supply Programming is disabled.

4: Minimum voltage is 3.2V for PIC18LF devices in the family. Minimum voltage is 4.2V for PIC18F devices in the family.

TABLE 28-2: COMPARATOR SPECIFICATIONS

Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C (unless otherwise stated)

Note 1: Response time measured with one comparator input at (VDD – 1.5)/2, while the other input transitions from VSS to VDD.

TABLE 28-3: VOLTAGE REFERENCE SPECIFICATIONS

Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C (unless otherwise stated)

Note 1: Settling time measured while CVRR = 1 and CVR3:CVR0 transitions from ‘0000’ to ‘1111’.

TABLE 28-4: USB MODULE SPECIFICATIONS

Operating Conditions: -40°C < TA < +85°C (unless otherwise stated).

TABLE 28-5: USB INTERNAL VOLTAGE REGULATOR SPECIFICATIONS

Operating Conditions: -40°C < TA < +85°C (unless otherwise stated).

Note 1: If device VDD is less than 4.0V, the internal USB voltage regulator should be disabled and an external 3.0-3.6V supply should be provided on VUSB if the USB module is used.

2: This is a recommended maximum for start-up time and in-rush considerations. When the USB regulator is disabled, there is no maximum.

FIGURE 28-3: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS

For VDIRMAG = 1: VDD VHLVD (HLVDIF set by hardware) (HLVDIF can be cleared in software) For VDIRMAG = 0: VDD HLVDIF

TABLE 28-6: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

28.4 AC (Timing) Characteristics

28.4.1 TIMING PARAMETER SYMBOLOGY

The timing parameter symbols have been created using one of the following formats:

1. TppS2ppS
2. TppS
3. Tcc:ST (I²C specifications only)
4. Ts (I²C specifications only)

Lowercase letters (pp) and their meanings:

Uppercase letters and their meanings:

Tcc:ST (I²C specifications only)

28.4.2 TIMING CONDITIONS

The temperature and voltages specified in Table 28-7 apply to all timing specifications unless otherwise noted. Figure 28-4 specifies the load conditions for the timing specifications.

Note: Because of space limitations, the generic terms “PIC18FXXXX” and “PIC18LFXXXX” are used throughout this section to refer to the PIC18F2455/2550/4455/4550 and PIC18LF2455/2550/4455/4550 families of devices specifically and only those devices.

TABLE 28-7: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

FIGURE 28-4: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS