A newbie question

"Reballing" is required to re-use parts in BGA packages that were once soldered onto a board. "Reballing" is a way to reclaim these BGA parts.

-- SKK

"Balls", as in Ball-Grid-Array describe the many small half-spheres of solder on the bottom of modern BGA packages, from a few hundred to over a thousand of them. In board assembly, these balls are heated up and collapse onto the pc-board "pad" and form a perfect solder joint. When, for any reason, a package has been removed from the pc-board, the balls are left behind or damaged or deformed, so the device package must be refurbished with new balls, and that step in re-manufacturing is called "re-balling". Peter Alfke

Thanks a lot for the explanations, it's well understood now what means reballing. I guess it must be a special process that you can't do in your home...