On a related note, I take that to mean you've got the layout going and all?
Don't know how many things are capable of doing that, at least in an integrated fashion. I recall reading Altium could do it, with what looked like a tedious setup (positioning the die lands and bond pads, and calling out each bond wire / pad pair), but that it apparently generates "PnP" data ready for wirebonding.
Tim
-- Seven Transistor Labs, LLC Electrical Engineering Consultation and Contract Design Website:
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Gentlemen,
Searched up and down the web but not much info. The PCB house (4PCB) offer three levels:
130 uinches nickel and then around 10uin (but not guaranteed) gold. Alternatively 30 uinches guaranteed min gold or 50 uinches min gold, and I guess those two options would be pricey.
Anyhow, no NiPdAu so no palladium in there. We need to ultrasonically bond 1mil gold wires. Would this thin 10 uinch flash gold be ok? I heard that down to 2 uinches has been used but I don't want to mess this up.
-- Regards, Joerg
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