Microchip PIC24 datasheet: 28.0 Packaging information

28.0 PACKAGING INFORMATION

28.1 Package Marking Information

28-Lead SPDIP (.300")

Example

28-Lead SSOP (5.30 mm)

Example

28-Lead SOIC (7.50 mm)

Example

Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week '01') NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn)

• This package is Pb-free. The Pb-free JEDEC designator (e3) can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.

28-Lead QFN (6X6 mm) Example XXXXXXX XXXXXXX YYWWNNN

24FJ48GA 002/ML e3 1310017

44-Lead QFN (8x8x0.9 mm) Example XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN 24FJ32GA 004-I/ML e3 1310017

44-Lead TQFP (10x10x1 mm) Example MICROCHIP XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN MICROCHIP 24FJ32GA 004-I/PT e3 1310017

28.2 Package Details

The following sections give the technical details of the packages.

28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-070B

28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-073B

28-Lead Plastic Shrink Small Outline (SS) - 5.30 mm Body [SSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

RECOMMENDED LAND PATTERN

Notes:

1. Dimensioning and tolerancing per ASME Y14.5M
   BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing No. C04-2073A

28-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Microchip Technology Drawing C04-052C Sheet 1 of 2

28-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimension D does not include mold flash, protrusions or gate burrs, which shall not exceed 0.15 mm per end. Dimension E1 does not include interlead flash or protrusion, which shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.

Microchip Technology Drawing C04-052C Sheet 2 of 2

28-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

RECOMMENDED LAND PATTERN

Notes:

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing No. C04-2052A

28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN] with 0.55 mm Contact Length

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-105B

28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN] with 0.55 mm Contact Length

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

RECOMMENDED LAND PATTERN

Notes:

1. Dimensioning and tolerancing per ASME Y14.5M
   BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing No. C04-2105A

DS39881E-page 260 © 2010-2013 Microchip Technology Inc.

44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Microchip Technology Drawing C04-103C Sheet 1 of 2

44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
   • BSC: Basic Dimension. Theoretically exact value shown without tolerances.
   • REF: Reference Dimension. usually without tolerance. for information purposes only.

Microchip Technology Drawing C04-103C Sheet 2 of 2

44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

RECOMMENDED LAND PATTERN

Notes:

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing No. C04-2103B

44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm [TQFP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-076B

44-Lead Plastic Thin Quad Flatpack (PT) 10X10X1 mm Body, 2.00 mm Footprint [TQFP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

RECOMMENDED LAND PATTERN

Notes:

1. Dimensioning and tolerancing per ASME Y14.5M
   BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing No. C04-2076B

NOTES:

DS39881E-page 266 © 2010-2013 Microchip Technology Inc.

APPENDIX A: REVISION HISTORY

Revision A (March 2007)

Original data sheet for the PIC24FJ64GA004 family of devices.

Revision B (March 2007)

Changes to Table 26-8; packaging diagrams updated.

Revision C (January 2008)

• Update of electrical specifications to include DC characteristics for Extended Temperature devices.
• Update for A/D converter chapter to include information on internal band gap voltage reference.
• Added “Appendix B: “Additional Guidance for PIC24FJ64GA004 Family Applications”.
• General revisions to incorporate corrections included in document errata to date (DS80333).

Revision D (January 2010)

• Update of electrical specifications to include 60°C specifications for power-down current to DC characteristics.
• Removes references to JTAG programming throughout the document.
• Other minor typographic corrections throughout.

Revision E (May 2013)

• Updates all pin diagrams to indicate 5V tolerant pins.
• Updates all package labeling diagrams.
• Changes the VREGS bit name (RCON<8>) to PMSLP in all occurrences throughout the data sheet; also updates the description of the bit’s functionality in Register 6-1. (The actual operation of the bit remains unchanged.)
• Adds additional explanatory text to the following sections:
  • Section 9.2.1 "Sleep Mode"
  • Section 10.4.2.1 "Peripheral Pin Select Function Priority"
  • Section 24.2.3 "On-Chip Regulator and POR"
• Updates Section 2.0 “Guidelines for Getting Started with 16-Bit Microcontrollers” with the most current information on VCAP selection.
• Replaces Table 6-3 (Reset Delay Times) with an updated version.
• Updates Section 7.0 "Interrupt Controller" by adding a description of the INTTREG register (Register 7-31).
• Updates Section 8.0 "Oscillator Configuration" by correcting the external oscillator inputs in Figure 8-1 and a new unlock code sequence in Example 8-1.
• Replaces Example 10-2 with a new code example.
• Updates Section 19.0 "Real-Time Clock and Calendar (RTCC)" to add introductory text and amend input sources in Figure 19-1.
• Updates Section 20.0 "Programmable Cyclic Redundancy Check (CRC) Generator" with a more current version (no technical changes to the module or its operation).
• Updates Section 26.0 "Instruction Set Summary":
  • Updates syntax of ASR, DAW, LSR, MOV and SL instructions to conform with the Programmer’s Reference Manual
  • Adds previously omitted instruction, FBCL
• Adds to Section 27.0 "Electrical Characteristics":
  • New Specification DC18 (VBOR) to Table 27-3
  • New Specifications DI60a (IICL), DI60b (IICH) and DI60c (ΣIICT) to Table 27-7
  • New Table 27-10 (Comparator Specifications) and Table 27-11 (Comparator Voltage Reference Specifications); previous Table 27-10 is now renumbered as Table 27-12, and all subsequent tables renumbered accordingly
  • New Table 27-17 (Internal RC Oscillator Specifications)
  • New specifications, AD08 (IVREF), AD09 (ZREF) and AD13 (Leakage Current), to Table 27-20
  • Combines previous Table 27-15 (AC Characteristics: Internal RC Accuracy) and Table 27-16 (Internal RC Accuracy) into a new Table 27-18 (AC Characteristics: Internal RC Accuracy)
• Other minor typographic corrections throughout.

APPENDIX B: ADDITIONAL GUIDANCE FOR PIC24FJ64GA004 FAMILY APPLICATIONS

B.1 Additional Methods for Power Reduction

Devices in the PIC24FJ64GA004 family include a number of core features to significantly reduce the application’s power requirements. For truly power-sensitive applications, it is possible to further reduce the application’s power demands by taking advantage of the device’s regulator architecture. These methods help decrease power in two ways: by disabling the internal voltage regulator to eliminate its power consumption, and by reducing the voltage on VDDCORE to lower the device’s dynamic current requirements. Using these methods, it is possible to reduce Sleep currents (IPD) from 3.5 µA to 250 nA (typical values, refer to Parameters DC60d and DC60g in Table 27-6). For dynamic power consumption, the reduction in VDDCORE from 2.5V provided by the regulator, to 2.0V, can provide a power reduction of about 30%.

When using a regulated power source or a battery with a constant output voltage, it is possible to decrease power consumption by disabling the regulator. In this case (Figure B-1), a simple diode can be used to reduce the voltage from 3V or greater to the 2V-2.5V required for VDDCORE. This method is only advised on power supplies, such as Lithium Coin cells, which maintain a constant voltage over the life of the battery.

FIGURE B-1: POWER REDUCTION EXAMPLE FOR CONSTANT VOLTAGE SUPPLIES

A similar method can be used for non-regulated sources (Figure B-2). In this case, it can be beneficial to use a low quiescent current, external voltage regulator. Devices, such as the MCP1700, consume only 1 µA to regulate to 2V or 2.5V, which is lower than the current required to power the internal voltage regulator.

FIGURE B-2: POWER REDUCTION EXAMPLE FOR NON-REGULATED SUPPLIES

INDEX

A

A/D Converter

• Analog Input Model ........ 200
• Transfer Function ........ 201

AC Characteristics

• A/D Conversion Requirements ........ 249

• A/D Specifications ........ 248

• CLKO and I/O Requirements ........ 247

• External Clock Requirements ........ 245

• Internal RC Accuracy ........ 246

• Internal RC Oscillator Specifications ........ 246

• PLL Clock Specifications ........ 246

• Temperature and Voltage Specifications ........ 244

• Additional Guidance for Family Applications ........ 268

Assembler

• MPASM Assembler ........ 220

B

Block Diagrams

• 10-Bit High-Speed A/D Converter ........ 194
• 16-Bit Timer1 ........ 125

Accessing Program Memory with

• Table Instructions ........ 45

• Addressable Parallel Slave Port Example ........ 174

• Addressing for Table Registers ........ 47

• CALL Stack Frame ........ 43

• Comparator I/O Operating Modes ........ 203

• Comparator Voltage Reference ........ 207

• CPU Programmer’s Model ........ 25

• CRC Module ........ 189

• CRC Shift Engine ........ 190

Data Access from Program Space

• Address Generation ........ 44

• I²C Module ........ 152

• Input Capture x ........ 133

• LCD Control Example, Byte Mode ........ 176

• Legacy Parallel Slave Port Example ........ 174

• Load Conditions for Timing Specifications ........ 244

• MCLR Pin Connections ........ 18

• On-Chip Regulator Connections ........ 215

• Output Compare x ........ 138

• Parallel EEPROM (Up to 11-Bit Address, 16-Bit Data) ........ 176

• Parallel EEPROM (Up to 11-Bit Address, 8-Bit Data) ........ 176

• Parallel Master Port (PMP) Module Overview ........ 167

• PIC24F CPU Core ........ 24

• PIC24FJ64GA004 Family (General) ........ 10

• PMP 8-Bit Multiplexed Addressing and Data Application ........ 176

• PMP Master Mode, Demultiplexed Addressing ........ 174

• PMP Master Mode, Fully Multiplexed Addressing ........ 175

• PMP Master Mode, Partially Multiplexed Addressing ........ 175

• PMP Multiplexed Addressing Application ........ 175

PMP Partially Multiplexed Addressing Application ... 175

• PSV Operation ........ 46

• Real-Time Clock and Calendar (RTCC) ........ 177

C

C Compilers

• MPLAB C18 ........ 220

Code Examples

• Basic Clock Switching Example ........ 101

• Configuring UART1 Input and Output Functions (PPS) ........ 110

• Erasing a Program Memory Block ........ 50

• I/O Port Read/Write ........ 106

• Initiating a Programming Sequence ........ 51

• Loading the Write Buffers ........ 51

• Setting the RTCWREN Bit ........ 178

• Single-Word Flash Programming ........ 52

• Code Protection ........ 218

Comparator Voltage Reference

• Configuring ........ 207

• Configuration Bits ........ 209

• Core Features ........ 7

CPU

• Arithmetic Logic Unit (ALU) ........ 27
• Control Registers ........ 26
• Core Registers ........ 25
• Programmer’s Model ........ 23

CRC

• Operation in Power Save Modes ........ 190

• Setup Example ........ 189

• User Interface ........ 190

• Customer Change Notification Service ........ 273

• Customer Notification Service ........ 273

• Customer Support ........ 273

D

Data Memory

• Address Space ........ 31

• Memory Map ........ 31

• Near Data Space ........ 32

• Organization ........ 32

• SFR Space ........ 32

• Software Stack ........ 43

• Recommended Minimum Connections ........ 17

• Reset System ........ 53

• Shared I/O Port Structure ........ 105

• Simplified UARTx Module ........ 159

• SPIx Master/Frame Master Connection ........ 149

• SPIx Master/Frame Slave Connection ........ 149

• SPIx Master/Slave Connection (Enhanced Buffer Mode) ........ 148

• SPIx Master/Slave Connection (Standard Mode) ........ 148

• SPIx Module (Enhanced Mode) ........ 143

• SPIx Module (Standard Mode) ........ 142

• SPIx Slave/Frame Master Connection ........ 149

• SPIx Slave/Frame Slave Connection ........ 149

• Suggested Placement of Oscillator Circuit ........ 21

• System Clock ........ 95

• Timer2 and Timer4 (16-Bit Synchronous Mode) ........ 129

• Timer2/3 and Timer4/5 (32-Bit Mode) ........ 128

• Timer3 and Timer5 (16-Bit Synchronous Mode) ........ 129

• Watchdog Timer (WDT) ........ 217

DC Characteristics

• Comparator Specifications ........ 243
• Comparator Voltage Reference
  • Specifications ........ 243
• I/O Pin Input Specifications ........ 240
• I/O Pin Output Specifications ........ 242
• Idle Current (IDLE) ........ 236
• Internal Voltage Regulator Specifications ........ 243
• Operating Current (IDD) ........ 235
• Power-Down Current (IPD) ........ 238
• Program Memory Specifications ........ 242
• Temperature and Voltage Specifications ........ 234
• Details on Individual Family Members ........ 8
• Development Support ........ 219
• Device Features (Summary) ........ 9
• DISVREG Pin ........ 215
• Doze Mode ........ 104

E Electrical Characteristics

• Absolute Maximum Ratings ........ 231
• Capacitive Loading Requirements on
  • Output Pins ........ 244
• Thermal Operating Conditions ........ 233
• Thermal Packaging ........ 233
• V/F Graphs (Extended Temperature) ........ 232
• V/F Graphs (Industrial Temperature) ........ 232 Equations
• A/D Conversion Clock Period ........ 200
• Baud Rate Reload Calculation ........ 153
• Calculating the PWM Period ........ 136
• Calculation for Maximum PWM Resolution ........ 136
• CRC Polynomial ........ 189
• Device and SPIx Clock Speed Relationship ........ 150
• UARTx Baud Rate with BRGH = 0 ........ 160
• UARTx Baud Rate with BRGH = 1 ........ 160
• Errata ........ 6
• External Oscillator Pins ........ 21

F

• Flash Configuration Words ........ 30, 209
• Flash Program Memory
  • and Table Instructions ........ 47
  • Enhanced ICSP Operation ........ 48
  • Operations ........ 48
  • Programming Algorithm ........ 50
  • RTSP Operation ........ 48
  • Single-Word Programming ........ 52

G

• Getting Started Guidelines ........ 17

I I/O Ports

• Analog Port Pins Configuration ........ 106
• Input Change Notification ........ 106
• Open-Drain Configuration ........ 106
• Parallel (PIO) ........ 105
• Peripheral Pin Select ........ 107
• Pull-ups ........ 106

I²C

• Baud Rate Setting When Operating as
  • Bus Master ........ 153
• Clock Rates ........ 153
• Master in a Single Master Environment
  • Communication ........ 151
• Peripheral Remapping Options ........ 151
• Reserved Addresses ........ 153
• Slave Address Masking ........ 153
• ICSP Operations
  • Analog and Digital Pins Configuration ........ 22
• ICSP Pins ........ 20
• Idle Mode ........ 104
• In-Circuit Debugger ........ 218
• In-Circuit Serial Programming (ICSP) ........ 218
• Instruction Set
  • Opcode Symbol Descriptions ........ 224
  • Overview ........ 225
  • Summary ........ 223
• Inter-Integrated Circuit. See I²C.
• Internet Address ........ 273
• Interrupts
  • Alternate Interrupt Vector Table (AIVT) ........ 59
  • and Reset Sequence ........ 59
  • Implemented Vectors ........ 61
  • Interrupt Vector Table (IVT) ........ 59
  • Registers ........ 62
  • Setup and Service Procedures ........ 94
  • Trap Vectors ........ 60
  • Vector Table ........ 60

J

• JTAG Interface ........ 218

M

• Master Clear Pin (MCLR) ........ 18
• Microchip Internet Web Site ........ 273
• MPLAB ASM30 Assembler, Linker, Librarian ........ 220
• MPLAB Integrated Development
  • Environment Software ........ 219
• MPLAB PM3 Device Programmer ........ 221
• MPLAB REAL ICE In-Circuit Emulator System ... 221
• MPLINK Object Linker/MPLIB Object Librarian .. 220

N

• Near Data Space ........ 32

O Oscillator Configuration

• Clock Switching ........ 100
  • Sequence ........ 101
• CPU Clocking Scheme ........ 96
• Initial Configuration on POR ........ 96
• Oscillator Modes ........ 96 Output Compare
• Continuous Output Pulse Generation Setup ........ 135
• PWM Mode ........ 136
  • Period and Duty Cycle Calculation ........ 137
• Single Output Pulse Generation Setup ........ 135

DS39881E-page 270 © 2010-2013 Microchip Technology Inc.

P

Packaging

• Details ........ 253
• Marking ........ 251

Parallel Master Port. See PMP.

• Peripheral Enable Bits ........ 104

• Peripheral Module Disable (PMD) Bits ........ 104

Peripheral Pin Select (PPS)

• Available Peripherals and Pins ........ 107

• Configuration Control ........ 109

• Considerations for Use ........ 110

• Input Mapping ........ 107

• Mapping Exceptions ........ 109

• Output Mapping ........ 109

• Peripheral Priority ........ 107

• Registers ........ 111–124

• Pinout Descriptions ........ 11–16

PMSLP Bit

• and Wake-up Time ........ 103

• Power Supply Pins ........ 18

Power-Saving Features

• Clock Frequency and Switching ........ 103

• Instruction-Based Modes ........ 103

• Selective Peripheral Power Control ........ 104

• Power-up Requirements ........ 216

• Product Identification System ........ 275

Program Memory

• Access Using Table Instructions ........ 45

• Address Construction ........ 43

• Address Space ........ 29

• Flash Configuration Words ........ 30

• Memory Map ........ 29

• Organization ........ 30

• Program Space Visibility (PSV) ........ 46

• Program Verification ........ 218

Pulse-Width Modulation. See PWM.

R

• Reader Response ........ 274

Register Maps

• A/D Converter (ADC) ........ 39
• Clock Control ........ 42
• CPU Core ........ 33
• CRC ........ 40
• Dual Comparator ........ 40
• I²C ........ 36
• ICN ........ 33
• Input Capture ........ 35
• Interrupt Controller ........ 34
• NVM ........ 42
• Output Compare ........ 36
• Pad Configuration ........ 38
• Parallel Master/Slave Port ........ 40
• Peripheral Pin Select (PPS) ........ 41
• PMD ........ 42
• PORTA ........ 38
• PORTB ........ 38
• PORTC ........ 38
• Real-Time Clock and Calendar (RTCC) ........ 40
• SPI ........ 37
• Timers ........ 35
• UART ........ 37

Registers

• AD1CHS (A/D Input Select) ........ 198
• AD1CON1 (A/D Control 1) ........ 195
• AD1CON2 (A/D Control 2) ........ 196
• AD1CON3 (A/D Control 3) ........ 197
• AD1CSSL (A/D Input Scan Select) ........ 199
• AD1PCFG (A/D Port Configuration) ........ 199
• ALCFGRPT (Alarm Configuration) ........ 181
• ALMINSEC (Alarm Minutes and Seconds Value) ........ 185
• ALMTHDY (Alarm Month and Day Value) ........ 184
• ALWDHR (Alarm Weekday and Hours Value) ........ 185
• CLKDIV (Clock Divider) ........ 99
• CMCON (Comparator Control) ........ 204
• CORCON (CPU Control) ........ 27, 63
• CRC CON (CRC Control) ........ 191
• CRCXOR (CRC XOR Polynomial) ........ 192
• CVRCON (Comparator Voltage Reference Control) ........ 208
• CW1 (Flash Configuration Word 1) ........ 210
• CW2 (Flash Configuration Word 2) ........ 212
• DEVID (Device ID) ........ 213
• DEVREV (Device Revision) ........ 214
• I2CxCON (I2Cx Control) ........ 154
• I2CxMSK (I2Cx Slave Mode Address Mask) ........ 157
• I2CxSTAT (I2Cx Status) ........ 156
• ICxCON (Input Capture x Control) ........ 134
• IEC0 (Interrupt Enable Control 0) ........ 72
• IEC1 (Interrupt Enable Control 1) ........ 74
• IEC2 (Interrupt Enable Control 2) ........ 75
• IEC3 (Interrupt Enable Control 3) ........ 76
• IEC4 (Interrupt Enable Control 4) ........ 77
• IFS0 (Interrupt Flag Status 0) ........ 66
• IFS1 (Interrupt Flag Status 1) ........ 68
• IFS2 (Interrupt Flag Status 2) ........ 69
• IFS3 (Interrupt Flag Status 3) ........ 70
• IFS4 (Interrupt Flag Status 4) ........ 71
• INTCON1 (Interrupt Control 1) ........ 64
• INTCON2 (Interrupt Control 2) ........ 65
• INTTREG (Interrupt Control and Status) ........ 93
• IPC0 (Interrupt Priority Control 0) ........ 78
• IPC1 (Interrupt Priority Control 1) ........ 79
• IPC10 (Interrupt Priority Control 10) ........ 88
• IPC11 (Interrupt Priority Control 11) ........ 88
• IPC12 (Interrupt Priority Control 12) ........ 89
• IPC15 (Interrupt Priority Control 15) ........ 90
• IPC16 (Interrupt Priority Control 16) ........ 91
• IPC18 (Interrupt Priority Control 18) ........ 92
• IPC2 (Interrupt Priority Control 2) ........ 80
• IPC3 (Interrupt Priority Control 3) ........ 81
• IPC4 (Interrupt Priority Control 4) ........ 82
• IPC5 (Interrupt Priority Control 5) ........ 83
• IPC6 (Interrupt Priority Control 6) ........ 84
• IPC7 (Interrupt Priority Control 7) ........ 85
• IPC8 (Interrupt Priority Control 8) ........ 86
• IPC9 (Interrupt Priority Control 9) ........ 87
• MINSEC (RTCC Minutes and Seconds Value) ........ 183
• MTHDY (RTCC Month and Day Value) ........ 182
• NVMCON (Flash Memory Control) ........ 49
• OCxCON (Output Compare x Control) ........ 139
• OSCCON (Oscillator Control) ........ 97
• OSCTUN (FRC Oscillator Tune) ........ 100

• PADC FG1 (Pad Configuration Control) ........ 173, 180
• PMADDR (Parallel Port Address) ........ 171
• PMAEN (Parallel Port Enable) ........ 171
• PMCON (Parallel Port Control) ........ 168
• PMMODE (Parallel Port Mode) ........ 170
• PMSTAT (Parallel Port Status) ........ 172 RCFGCAL (RTCC Calibration
• and Configuration) ........ 179
• RCON (Reset Control) ........ 54
• RPINR0 (Peripheral Pin Select Input 0) ........ 111
• RPINR1 (Peripheral Pin Select Input 1) ........ 111
• RPINR11 (Peripheral Pin Select Input 11) ........ 114
• RPINR18 (Peripheral Pin Select Input 18) ........ 115
• RPINR19 (Peripheral Pin Select Input 19) ........ 115
• RPINR20 (Peripheral Pin Select Input 20) ........ 116
• RPINR21 (Peripheral Pin Select Input 21) ........ 116
• RPINR22 (Peripheral Pin Select Input 22) ........ 117
• RPINR23 (Peripheral Pin Select Input 23) ........ 117
• RPINR3 (Peripheral Pin Select Input 3) ........ 112
• RPINR4 (Peripheral Pin Select Input 4) ........ 112
• RPINR7 (Peripheral Pin Select Input 7) ........ 113
• RPINR8 (Peripheral Pin Select Input 8) ........ 113
• RPINR9 (Peripheral Pin Select Input 9) ........ 114
• RPOR0 (Peripheral Pin Select Output 0) ........ 118
• RPOR1 (Peripheral Pin Select Output 1) ........ 118
• RPOR10 (Peripheral Pin Select Output 10) ........ 123
• RPOR11 (Peripheral Pin Select Output 11) ........ 123
• RPOR12 (Peripheral Pin Select Output 12) ........ 124
• RPOR2 (Peripheral Pin Select Output 2) ........ 119
• RPOR3 (Peripheral Pin Select Output 3) ........ 119
• RPOR4 (Peripheral Pin Select Output 4) ........ 120
• RPOR5 (Peripheral Pin Select Output 5) ........ 120
• RPOR6 (Peripheral Pin Select Output 6) ........ 121
• RPOR7 (Peripheral Pin Select Output 7) ........ 121
• RPOR8 (Peripheral Pin Select Output 8) ........ 122
• RPOR9 (Peripheral Pin Select Output 9) ........ 122
• SPIxCON1 (SPIx Control 1) ........ 146
• SPIxCON2 (SPIx Control 2) ........ 147
• SPIxSTAT (SPIx Status and Control) ........ 144
• SR (ALU STATUS) ........ 26, 63
• T1CON (Timer1 Control) ........ 126
• TxCON (Timer2 and Timer4 Control) ........ 130
• TyCON (Timer3 and Timer5 Control) ........ 131
• UxMODE (UARTx Mode) ........ 162
• UxRXREG (UARTx Receive) ........ 166
• UxSTA (UARTx Status and Control) ........ 164
• UxTXREG (UARTx Transmit) ........ 166
• WKDYHR (RTCC Weekday and Hours Value) ........ 183
• YEAR (RTCC Year Value) ........ 182

Resets

• Brown-out Reset (BOR) ........ 53

• Clock Source Selection ........ 56

• Configuration Mismatch Reset (CM) ........ 53

• Delay Times ........ 56

• Device Reset Times ........ 56

• Illegal Opcode Reset (IOPUWR) ........ 53

• Master Clear Pin Reset (MCLR) ........ 53

• Power-on Reset (POR) ........ 53

• RCON Flags Operation ........ 55

• SFR States ........ 57

• Software RESET Instruction (SWR) ........ 53

• Trap Conflict Reset (TRAPR) ........ 53

• Uninitialized W Register Reset (UWR) ........ 53

• Watchdog Timer Reset (WDT) ........ 53

• Revision History ........ 267 RTCC

• Alarm Configuration ........ 186

• Alarm Mask Settings ........ 187

• Calibration ........ 186

• Register Mapping ........ 178

• Write Lock ........ 178

S
Serial Peripheral Interface. See SPI.

• SFR Space ........ 32
• Sleep Mode ........ 103
• Software Simulator (MPLAB SIM) ........ 221
• Software Stack ........ 43
• Special Features ........ 8 SPI
• Enhanced Buffer Master Mode Setup ........ 143
• Enhanced Buffer Slave Mode Setup ........ 143
• Standard Master Mode Setup ........ 141
• Standard Slave Mode Setup ........ 141

T

• Timer1 ........ 125
• Timer2/3 and Timer4/5 ........ 127 Timing Diagrams
• CLKO and I/O ........ 247
• External Clock ........ 245

U
UART

• Baud Rate Generator (BRG) ........ 160
• Break and Sync Transmit Sequence ........ 161
• IrDA Support ........ 161
• Operation of UxCTS and UxRTS Control Pins ........ 161
• Receiving in 8-Bit or 9-Bit Data Mode ........ 161
• Transmitting in 8-Bit Data Mode ........ 161
• Transmitting in 9-Bit Data Mode ........ 161 Universal Asynchronous Receiver Transmitter. See UART.
• Unused I/Os ........ 22

V

• VDDCORE/VCAP Pin ........ 215
• Voltage Regulator (On-Chip) ........ 215
• and BOR ........ 215
• and POR ........ 216
• Low-Voltage Detection (LVD) ........ 215
• Standby Mode ........ 216
• Tracking Mode ........ 215
• Voltage Regulator Pins ........ 19

W

• Watchdog Timer (WDT) ........ 216
• Windowed Operation ........ 217
• WWW Address ........ 273
• WWW, On-Line Support ........ 6

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

CUSTOMER CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.

To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Development Systems Information Line

Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

Technical support is available through the web site at: http://microchip.com/support

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

TO: Technical Publications Manager RE: Reader Response Total Pages Sent _______

From: Name _________________________________________________________________ Company ______________________________________________________________ Address _______________________________________________________________ City / State / ZIP / Country _____________________________________________ Telephone: () _______ - _______ FAX: () _______ - _______

Application (optional): Would you like a reply? ___ Y ___ N

Device: PIC24FJ64GA004 Family Literature Number: DS39881E

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

a) PIC24FJ32GA002-I/ML:
General Purpose PIC24F, 32-Kbyte Program Memory, 28-Pin, Industrial Temp., QFN Package.

b) PIC24FJ64GA004-E/PT:
General Purpose PIC24F, 64-Kbyte Program Memory, 44-Pin, Extended Temp., TQFP Package.

NOTES:

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC$^{32}$ logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEm, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

© 2010-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

Printed on recycled paper.

ISBN: 978-1-62077-201-0

QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV = ISO/TS 16949 =

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

Worldwide Sales and Service

AMERICAS

Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/support
Web Address:
www.microchip.com

Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455

Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088

Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075

Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643

Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924

Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260

Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453

Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608

Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445

Toronto
Mississauga, Ontario, Canada
Tel: 905-673-0699
Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431

Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755

China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104

China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889

China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500

China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189

China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431

China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470

China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205

China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066

China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393

China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760

China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118

China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256

China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130

China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049

ASIA/PACIFIC

India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123

India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632

India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513

Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310

Japan - Yokohama
Tel: 81-45-471-6166
Fax: 81-45-471-6122

Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302

Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or 82-2-558-5934

Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859

Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068

Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069

Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850

Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955

Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305

Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102

Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350

EUROPE

Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393

Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829

France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79

Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44

Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781

Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340

Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91

UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820

11/29/11