I've never seen an unstiffened board without a "little bit" of warp. If it needs to be perfectly flat you need to put it in some sort of frame that is flat.
Sounds like the cow-orker an hour after he was convinced that decoupling caps actually did something; the board was *covered* with the things! ILMAO!
If someone doesn't support those capacitor manufacturers, are YOU going to be the one whose tax dollars pay for their bailout?
Oh, wait, they'll almost all foreign companies these days anyway.
Nevermind.
I think at least 1 cap per square centimeter of board space is adequate for most designs. High-speed designs might need more... maybe as many as 1 per square millimeter...
Does that matter?
LOL. The speed doesn't matter so much as the edge rates. The stuff I'm designing now is as slow as I've ever done, yet the edge rates of the cheapest logic is faster than the ECL when I started out. ...and a lot pickier on decoupling (ECL is easy).
You can often go to a cross-hatch structure for (some) planes if warping becomes a serious problem. Or place some dummy copper pour on the opposite layer to improve the thermal balance.
Have something to add? Share your thoughts — no account required.
Ask the community — no account required