Instead of prototyping "dead bug" on the usual sheet of copper-clad FR4, has anyone tried laying out more "permanent prototypes" of RF circuits where you a) place all your components on a piece of through-hole "blob board" and solder them in place; b) put a blob of solder on all the unused pads and join them together with solder bridges in a grid, then ground the grid, and c) connect up your components on the underside using thin solid-cored jumper wire laid over the grid?
Would the grid work at all well as a ground plane?