Chip Packaging Engineer - Toronto

Hello,

Thinkpath Engineering is a large engineering services company with a 27 year track record in Engineering and Design services. We are a global provider of engineering services, design, build, drafting, technical publishing & documentation and on-site engineering support. Thinkpath enables corporations to reinvent themselves structurally; drive strategies of innovation, speed to market, globalization and focus in new and bold ways. We are experts in the aerospace, automotive, defense, manufacturing and health care industries. With 6 offices in Canada and the US, we are always looking for talented people.

We are seeking a Chip Packaging Engineer with at least 5 years of experience in multi-chip package design. You must have a strong background in multi chip package design, wire bond assembly, encapsulation, package stacking, thermal analysis and test. You will be involved in the research and development of the electrical, thermal and mechanical design aspects of these new products. You will also help drive the introduction and realization of these products into a full scale production environment.

In this role, you will interact with other talented, experienced, and energetic team members and engage with a wide variety of professional, top notch external suppliers, subcontractors, and customers. You will ensure that products are designed in a manner that will result in the efficient production of high quality products using the most cost effective designs, materials and manufacturing processes available.

Working in a fast growing, early stage company environment will require that you be a creative thinker and a resourceful problem solver. You must be a results-driven, self starter with strong communication and interpersonal skills who is capable of working both independently and in a team environment.

You have excellent communication skills and ability to demonstrate proficiency in AutoCAD software. You must have a professional qualification as a Electrical Engineer. You will benefit by working with a committed team of professional engineers supported by a sophisticated infrastructure at Thinkpath. Ideal candidates will possess a strong and demonstrable design track record in the electronics industries.

Responsibilities

=B7 Develop concepts and define specifications for new multi chip packages for dense, high speed applications to meet industry and customer quality standards =B7 Select appropriate materials including those for die attach, encapsulation, adhesive, and solder paste to achieve the desired mechanical, electrical, thermal (dissipation and CTE matching), and reliability properties =B7 Perform thermal modeling, analysis and testing of multi chip packages =B7 Utilize package characterization techniques and DOE methodology for development =B7 Design multi chip packages using wire bond assembly and provide wire bonding diagrams =B7 Source, audit and establish technical relationships with a high quality vendor manufacturing base =B7 Co-ordinate prototype builds and develop ultimate production level manufacturing process flow including die attach, wirebonding, encapsulation, solder bumping, package stacking, and heat sink attach =B7 Assist in test development (test fixtures, programs, analysis, debug) at chip package level =B7 Implement appropriate quality plans including SPC

Education, Skills and Experience =B7 5 years minimum in high speed IC packaging =B7 Strong understanding of various Package Interconnect Technologies and experienced with JEDEC and IPC requirements for electronic packaging =B7 Must be proficient in advanced packaging technologies including CSP, QFN, BGA, MCM/MCP, and Package Stacking =B7 Must have experience with wire bond assembly and encapsulation process and thermal management, modeling and analysis =B7 Must have strong understanding of solder joint reliability =B7 Experience in package level test, data collection, FA and debug =B7 Must be proficient in AutoCAD or equivalent =B7 Must have a BS or MS in Electrical Engineering or Materials Science equivalent =B7 Experience with the coordination of internal and external resources =B7 Strong written and verbal communication skills required

If you think you are the right candidate for this dynamic opportunity, please forward your Word resume and a cover letter to Kelsey Jones at snipped-for-privacy@yahoo.com immediately. This is a long term contract position. Please provide your contract rate expectations.

We pay referral bonuses to anyone who refers a good candidate that gets hired for at leat 90 days. If you know anyone who is qualified, please email the contact and phone number to Kelsey Jones at snipped-for-privacy@yahoo.com.

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