Hi - I am finishing up work on a 2 layer board. The bottom copper is a ground plane (though it is interrupted in many places by mostly short traces). The top copper also has in one place a ground plane that is used to protect a particuarly sensitive module. My primary question is this: How should I connect these two ground planes? I figure I should just periodically place VIAs between them. But how many vias and how often? A via/cm^2? 10 vias/cm^2? I should note that almost the entire board is surface mount, so there are few pins going between the planes connecting them. Or - instead of distributing them evenly - should I be 'tacking' the corners of the top (smaller) ground plane with vias? Or should I be making a sort of line of vias around the border of the top ground plane?
On a very related note: I have two DC/DC modules on the board. Connected to each are two fairly large surface mount capacitors (1 Panasonic G package and 1 1210 package). These capacitors are connected between ground and the output of the DC/DC modules. There is a ground plane beneath them (the one on the bottom copper). What I am unsure of is this: should I connect a trace between their grounded sides and the ground pins of the dc/dc switchers? Or, should I put vias on them going straight to ground. Or, should I connect a trace between them and the ground pin on the dc/dc switcher and also put vias on that trace connecting it to ground? Right now I'm favoring the third of those - but I'm unsure. If I do it that way, same question as above, how many vias should I be putting on the traces? They're fairly hefty - 2mm in width. Or - should I connect them in some other way?
Thanks,
-Mike