Has anyone filled vias with solder to improve thermal and electrical conduction?
I figure that if a via has an unmasked pad, and it's solder pasted and reflowed, the solder will melt and flow into the via, partially or completely plugging it with solder.
Maybe arrange for 2x the paste that would fill the via volume?
I found this online:
which seems to contain a lot of nonsense.
Seems to me that plugging a via with solder will radically reduce its resistances, and that lots of small vias are better than one big one.