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IBM basically created the transistor business. They developed their own pla nar process, then needed more capacity, so they set TI up in the transistor business--they gave them all the fab equipment and everything. That line ran for, like, 30 years. Even in 1987, IBM was making a quarter of the wor ld's semiconductors. (Probably by value rather than by pound.)
Classically, Fishkill made logic and packaging, and Burlington made DRAM. In my time in Manufacturing Research, the DRAM generations were Antelope (1 Mb), Gazelle (4Mb), Luna (16Mb), Oberon (64 Mb) and Titan (256 Mb). I buil t measurement tools for Luna and Oberon, as well as retrofitting Perkin-Elm er Censor G-line wafer steppers with an improved alignment system so that I BM could squeeze another logic generation out of them before going to I-lin e (365 nm). That was ATX-4 ECL.
The bricks were (and I think still are) made in East Fishkill NY. They're sintered in a 30-foot-long belt oven filled with hot hydrogen. I've talked about it here before--it's like the throne room of the Great Oz.
The original alumina/refractory metal ones were in continuous use for over
20 years without a single field failure. The problem was that alumina has an epsilon of 9.5 or something like that, so propagation speed was slow and capacitance high. That didn't matter so much with 100-MHz clocks and ECL drivers, but it sure did with CMOS, so they went to a copper/glass-ceramic system. That was a disaster--in the old bricks, the metal had lower CTE th an the ceramic, and so was under compression in use. With the copper/glass bricks, the copper was in tension, so they had a lot of reliability proble ms in development, to the point that it looked like it was going to fail.Then some bright spark figured out that if you gave the brick a really big thermal shock, you could crack the copper loose from the glass matrix, so i t wasn't in tension any more. Otherwise they'd never have been able to shi p it, I don't think.
There were giants in those days. ;)
Cheers
Phil Hobbs