Seems that an IC could be "banned" if the leadframe *plating* (their "material") has more than 0.1% of lead even tho the over-all percentage of lead for the IC might be 0.01%. Is this a correct interpretation?
However, the plating could be pure lead and the IC would "pass" because that could be considered a high melting point solder even tho the over-all percentage of lead for the IC might be (say) 1%. Is this a correct interpretation?
And..what solder is "high melting point" solder? Where is the "boundary"?