Microchip PIC32 datasheet: 30.0 Packaging information

Published by Microchip · pages 191–214 of 214 · Original PDF

71 discussions about the Microchip PIC32

All 10 parts of the datasheet

30.0 PACKAGING INFORMATION

30.1 Package Marking Information

64-Lead TQFP (10x10x1 mm)

Example

100-Lead TQFP (12x12x1 mm)

Example

64-Lead QFN (9x9x0.9 mm)

Example

121-Lead XBGA (10x10x1.1 mm)

Example

Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week '01') NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn)

  • This package is Pb-free. The Pb-free JEDEC designator (e3) can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.

Figure from the manual

Figure from the manual

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30.2 Package Details

The following sections give the technical details of the packages.

64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm [TQFP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Figure from the manual

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Leads N 64
Lead Pitch e 0.50 BSC
Overall Height A – – 1.20
Molded Package Thickness A2 0.95 1.00 1.05
Standoff A1 0.05 – 0.15
Foot Length L 0.45 0.60 0.75
Footprint L1 1.00 REF
Foot Angle φ 0° 3.5° 7°
Overall Width E 12.00 BSC
Overall Length D 12.00 BSC
Molded Package Width E1 10.00 BSC
Molded Package Length D1 10.00 BSC
Lead Thickness c 0.09 – 0.20
Lead Width b 0.17 0.22 0.27
Mold Draft Angle Top α 11° 12° 13°
Mold Draft Angle Bottom β 11° 12° 13°

Notes:

  1. Pin 1 visual index feature may vary, but must be located within the hatched area.
  2. Chamfers at corners are optional; size may vary.
  3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
  4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-085B

64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 2.00 mm Footprint [TQFP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Figure from the manual

RECOMMENDED LAND PATTERN

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 0.50 BSC
Contact Pad Spacing C1 11.40
Contact Pad Spacing C2 11.40
Contact Pad Width (X64) X1 0.30
Contact Pad Length (X64) Y1 1.50
Distance Between Pads G 0.20

Notes:

  1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing No. C04-2085B

64-Lead Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body [QFN]

With 7.15 x 7.15 Exposed Pad [QFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Figure from the manual

Microchip Technology Drawing C04-149C Sheet 1 of 2

DS61143H-page 194 © 2011 Microchip Technology Inc.

64-Lead Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body [QFN]

With 7.15 x 7.15 Exposed Pad [QFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Figure from the manual

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 64
Pitch e 0.50 BSC
Overall Height A 0.80 0.90 1.00
Standoff A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Width E 9.00 BSC
Exposed Pad Width E2 7.05 7.15 7.50
Overall Length D 9.00 BSC
Exposed Pad Length D2 7.05 7.15 7.50
Contact Width b 0.18 0.25 0.30
Contact Length L 0.30 0.40 0.50
Contact-to-Exposed Pad K 0.20 - -

Notes:

  1. Pin 1 visual index feature may vary, but must be located within the hatched area.
  2. Package is saw singulated.
  3. Dimensioning and tolerancing per ASME Y14.5M.
    BSC: Basic Dimension. Theoretically exact value shown without tolerances.
    REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-149C Sheet 2 of 2

64-Lead Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body [QFN]
With 0.40 mm Contact Length

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Figure from the manual

RECOMMENDED LAND PATTERN

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 0.50 BSC
Optional Center Pad Width W2 7.35
Optional Center Pad Length T2 7.35
Contact Pad Spacing C1 8.90
Contact Pad Spacing C2 8.90
Contact Pad Width (X64) X1 0.30
Contact Pad Length (X64) Y1 0.85
Distance Between Pads G 0.20

Notes:

  1. Dimensioning and tolerancing per ASME Y14.5M
    BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing No. C04-2149A

100-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm [TQFP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Figure from the manual

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Leads N 100
Lead Pitch e 0.40 BSC
Overall Height A – – 1.20
Molded Package Thickness A2 0.95 1.00 1.05
Standoff A1 0.05 – 0.15
Foot Length L 0.45 0.60 0.75
Footprint L1 1.00 REF
Foot Angle φ 0° 3.5° 7°
Overall Width E 14.00 BSC
Overall Length D 14.00 BSC
Molded Package Width E1 12.00 BSC
Molded Package Length D1 12.00 BSC
Lead Thickness c 0.09 – 0.20
Lead Width b 0.13 0.18 0.23
Mold Draft Angle Top α 11° 12° 13°
Mold Draft Angle Bottom β 11° 12° 13°

Notes:

  1. Pin 1 visual index feature may vary, but must be located within the hatched area.
  2. Chamfers at corners are optional; size may vary.
  3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
  4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-100B

100-Lead Plastic Thin Quad Flatpack (PT)-12x12x1mm Body, 2.00 mm Footprint [TQFP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Figure from the manual

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 0.40 BSC
Contact Pad Spacing C1 13.40
Contact Pad Spacing C2 13.40
Contact Pad Width (X100) X1 0.20
Contact Pad Length (X100) Y1 1.50
Distance Between Pads G 0.20

Notes:

  1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing No. C04-2100B

121-Lead Plastic Thin Profile Ball Grid Array (BG) - 10x10x1.10 mm Body [XBGA]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Figure from the manual

TOP VIEW

DETAIL A DETAIL B

BOTTOM VIEW

Microchip Technology Drawing C04-148B Sheet 1 of 2

121-Lead Plastic Thin Profile Ball Grid Array (BG) - 10x10x1.10 mm Body [XBGA]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Figure from the manual

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Contacts N 121
Contact Pitch e 0.80 BSC
Overall Height A 1.00 1.10 1.20
Standoff A1 0.25 0.30 0.35
Molded Package Thickness A2 0.55 0.60 0.65
Overall Width E 10.00 BSC
Array Width E1 8.00 BSC
Overall Length D 10.00 BSC
Array Length D1 8.00 BSC
Contact Diameter b 0.40 TYP

Notes:

  1. Pin 1 visual index feature may vary, but must be located within the hatched area.
  2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only.
  3. The outer rows and columns of balls are located with respect to datums A and B.

Microchip Technology Drawing C04-148 Rev B Sheet 2 of 2

121-Lead Plastic Thin Profile Ball Grid Array (BG) - 10x10x1.10 mm Body [XBGA]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Figure from the manual

RECOMMENDED LAND PATTERN

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E1 0.80 BSC
Contact Pitch E2 0.80 BSC
Contact Pad Spacing C1 8.00
Contact Pad Spacing C2 8.00
Contact Pad Diameter (X121) X 0.32

Notes:

  1. Dimensioning and tolerancing per ASME Y14.5M
    BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing No. C04-2148B

NOTES:

APPENDIX A: REVISION HISTORY

Revision E (July 2008)

  • Updated the PIC32MX340F128H features in Table 1 to include 4 programmable DMA channels.

Revision F (June 2009)

This revision includes minor typographical and formatting changes throughout the data sheet text.

Global changes include:

  • Changed all instances of OSCI to OSC1 and OSCO to OSC2
  • Changed all instances of VDDCORE and VDDCORE/VCAP to VCAP/VDDCORE
  • Deleted registers in most sections, refer to the related section of the “PIC32 Family Reference Manual” (DS61132).

The other changes are referenced by their respective section in the following table.

TABLE A-1: MAJOR SECTION UPDATES

Section Name Update Description
“High-Performance, General Purpose and USB 32-bit Flash Microcontrollers” Added a “Packages” column to Table 1 and Table 2.Corrected all pin diagrams to update the following pin names.• Changed PGC1/EMUC1 to PGEC1• Changed PGD1/EMUD1 to PGED1• Changed PGC2/EMUC2 to PGEC2• Changed PGD2/EMUD2 to PGED2Shaded appropriate pins in each diagram to indicate which pins are 5V tolerant.Added 64-Lead QFN package pin diagrams, one for General Purpose and one for USB.
Section 1.0 “Device Overview” Reconstructed Figure 1-1 to include Timers, ADC and RTCC in the block diagram.
Section 2.0 “Guidelines for Getting Started with 32-bit Microcontrollers” Added a new section to the data sheet that provides the following information:• Basic Connection Requirements• Capacitors• Master Clear Pin• ICSP™ Pins• External Oscillator Pins• Configuration of Analog and Digital Pins• Unused I/Os
Section 4.0 “Memory Organization” Updated the memory maps, Figure 4-1 through Figure 4-6.All summary peripheral register maps were relocated to Section 4.0 “Memory Organization”.
Section 7.0 “Interrupt Controller” Removed the “Address” column from Table 7-1.
Section 12.0 “I/O Ports” Added a second paragraph in Section 12.1.3 “Analog Inputs” to clarify that all pins that share ANx functions are analog by default, because the AD1PCFG register has a default value of 0x0000.

TABLE A-1: MAJOR SECTION UPDATES (CONTINUED)

Section Name Update Description
Section 26.0 “Special Features” Modified bit names and locations in Register 26-5 “DEVID: Device and Revision ID Register”.Replaced “TSTARTUP” with “TPU”, and “64-ms nominal delay” with “TPWRT”, in Section 26.3.1 “On-Chip Regulator and POR”.The information that appeared in the Watchdog Timer and the Programming and Diagnostics sections of 61143E version of this data sheet has been incorporated into the Special Features section:• Section 26.2 “Watchdog Timer (WDT)”• Section 26.4 “Programming and Diagnostics”
Section 29.0 “Electrical Characteristics” Added the 64-Lead QFN package to Table 29-3.Updated data in Table 29-5.Updated data in Table 29-7.Updated data in Table 29-4, Table 29-5, Table 29-7 and Table 29-8.Updated data in Table 29-11.Added OS42 parameter to Table 29-17.Replaced Table 29-23.Replaced Table 29-24.Replaced Table 29-25.Updated Table 29-36.
Section 30.0 “Packaging Information” Added 64-Lead QFN package marking information to Section 30.1 “Package Marking Information”.Added the 64-Lead QFN (MR) package drawing and land pattern to Section 30.2 “Package Details”.
“Product Identification System” Added the MR package designator for the 64-Lead (9x9x0.9) QFN.

Revision G (April 2010)

The revision includes the following global update:

  • Added Note 2 to the shaded table that appears at the beginning of each chapter. This new note provides information regarding the availability of registers and their associated bits.

This revision also includes minor typographical and formatting changes throughout the data sheet text. Major updates are referenced by their respective section in the following table.

TABLE A-2: MAJOR SECTION UPDATES

Section Name Update Description
“High-Performance, General Purpose and USB 32-bit Flash Microcontrollers” Updated the crystal oscillator range to 3 MHz to 25 MHz (see Peripheral Features:)Added the 121-pin Ball Grid Array (XBGA) pin diagram.Updated Table 1: “PIC32MX General Purpose – Features” and Table 2: “PIC32MX USB – Features”Added the following tables:- Table 3: “Pin Names: PIC32MX320F128L, PIC32MX340F128L, and PIC32MX360F128L, and PIC32MX360F512L Devices”,- Table 4: “Pin Names: PIC32MX440F128L, PIC32MX460F256L and PIC32MX460F512L Devices”Updated the following pins as 5V tolerant:- 64-pin QFN (USB): Pin 34 (VBUS), Pin 36 (D-/RG3) and Pin 37 (D+/RG2)- 64-pin TQFP (USB): Pin 34 (Vbus), Pin 36 (D-/RG3), Pin 37 (D+/RG2) and Pin 42 (IC1/RTCC/INT1/RD8)- 100-pin TQFP (USB): Pin 54 (VBUS), Pin 56 (D-/RG3) and Pin 57 (D+/RG2)
Section 1.0 “Device Overview” Updated the Pinout I/O Descriptions table to include the device pin numbers (see Table 1-1)
Section 2.0 “Guidelines for Getting Started with 32-bit Microcontrollers” Updated the Ohm value for the low-ESR capacitor from less than 5 to less than 1 (see Section 2.3.1 “Internal Regulator Mode”).Labeled the capacitor on the VCAP/VDDCORE pin as CEFC in Figure 2-1.Changed 10 μF capacitor to CEFC capacitor in Section 2.3 “Capacitor on Internal Voltage Regulator (VCAP/VCORE)”.
Section 4.0 “Memory Organization” Updated all register map tables to include the “All Resets” column.Separated the PORT register maps into individual tables (see Table 4-21 through Table 4-34).In addition, formatting changes were made to improve readability.
Section 12.0 “I/O Ports” Updated the second paragraph of Section 12.1.2 “Digital Inputs” and removed Table 12-1.
Section 22.0 “10-bit Analog-to-Digital Converter (ADC)” Updated the ADC Conversion Clock Period Block Diagram (see Figure 22-2).
Section 26.0 “Special Features” Extensive updates were made to Section 26.2 “Watchdog Timer (WDT)” and Section 26.3 “On-Chip Voltage Regulator”.

TABLE A-2: MAJOR SECTION UPDATES (CONTINUED)

Revision H (May 2011)

The revision includes the following global update:

  • All references to VDDCORE/VCAP have been changed to: VCORE/VCAP
  • Added references to the new V-Temp temperature range: -40°C to +105°C

This revision also includes minor typographical and formatting changes throughout the data sheet text. Major updates are referenced by their respective section in the following table.

TABLE A-3: MAJOR SECTION UPDATES

Section Name Update Description
Section 1.0 “Device Overview” Updated the VBUS description in Table 1-1: “Pinout I/O Descriptions”.
Section 4.0 “Memory Organization” Added Note 2 and changed the RIPL<2:0> bits to SRIPL<2:0> in the Interrupt Register Map tables (see Table 4-2 through Table 4-6. Added Note 2 to the Timer1-5 Register Map (see Table 4-7). Updated the All Resets value for I2C1CON<15:0> and I2C2CON<15:0> in the I2C1 and I2C2 Register Map (see Table 4-10). Updated the All Resets value for SPI1STAT<15:0> and SPI2STAT<15:0> in the SPI1 and SPI2 Register Map (see Table 4-12). Updated the All Resets value for CM1CON<15:0> and CM2CON<15:0> in the Comparator Register Map (see Table 4-17). Renamed the RCDIV<2:0> bits to FRCDIV<2:0> and the LOCK bit to SLOCK in the OSCCON register, and added Note 3 and the SYSKEYregister to the System Control Registers Map (see Table 4-20). Updated the All Resets value for the PMSTAT register in the Parallel Master Port Register Map (see Table 4-37). Updated the All Resets value for CHECON<15:0> and CHETAG<15:0> in the Prefetch Register Map (see Table 4-39). Renamed FUPLEN, FUPLLDIV, and FPLLMULT in the DEVCFG2 register to: UPLEN, UPLLDIV, and FPLLMUL, respectively in the Device Configuration Word Summary (see Table 4-41). Added Notes 1 through 4 to the USB Register Map (see Table 4-43).
Section 5.0 “Flash Program Memory” Added a note on Flash LVD Delay and Example 5-1.
Section 8.0 “Oscillator Configuration” Updated the PIC32MX3XX/4XX Family Clock Diagram (see Figure 8-1).
Section 11.0 “USB On-The-Go (OTG)” Updated the PIC32MX3XX/4XX Family USB Interface Diagram (see Figure 11-1).
Section 16.0 “Output Compare” Updated the Output Compare Module Block Diagram (see Figure 16-1).
Section 22.0 “10-bit Analog-to-Digital Converter (ADC)” Updated the ADC Conversion Clock Period Block Diagram (see Figure 22-2).
Section 26.0 “Special Features” Renamed FUPLEN, FUPLLDIV, and FPLLMULT in the DEVCFG2 register to: UPLEN, UPLLDIV, and FPLLMUL, respectively (see Register 26-3).

TABLE A-3: MAJOR SECTION UPDATES (CONTINUED)

Section Name Update Description
Section 29.0 “Electrical Characteristics” Added the new V-Temp temperature range (-40°C to +105°C) to the heading of all specification tables.Updated the Ambient temperature under bias, updated the Voltage on any 5V tolerant pin with respect to VSS when VDD < 2.3V, and added Voltage on VBUS with respect to Vss in Absolute Maximum Ratings.Added the characteristic, DC5a to Operating MIPS vs. Voltage (see Table 29-1).Updated or added the following parameters to the Operating Current (IDD) DC Characteristics: DC20, DC23, DC24c, DC25d, DC26c (see Table 29-5).Added the following parameters to the Idle Current (IDLE) DC Characteristics: DC30c, DC31c, DC32c, DS33c, DC34c, DC35c, and DC36c (see Table 29-6).Added the following parameters to the Power-down Current (IPD) DC Characteristics: DC40g, DC40h, DC40i, DC41g, DC41h, DC42g, DC42h, DC42i, DC43h, and DC43i (see Table 29-7).Added the Brown-out Reset (BOR) Electrical Characteristics (see Table 29-10).Removed all Conditions from the Program Memory DC Characteristics (see Table 29-11).Removed the AC Characteristics voltage reference table (Table 29-15).Added Note 2 to the PLL Clock Timing Specifications (see Table 29-18).Updated the OC/PWM Module Timing Characteristics (see Figure 29-9).Added parameter IM51 and Note 3 to the I2Cx Bus Data Timing Requirements (Master Mode) (see Table 29-32).Added parameter numbers (AD13, AD14, and AD15) to the ADC Module Specifications (see Table 29-34).Updated the 10-bit ADC Conversion Rate Parameters (see Table 29-35).Updated parameter AD57 (TSAMP) in the Analog-to-Digital Conversion Timing Requirements (see Table 29-36).Updated the Conditions for parameters USB313, USB318, and USB319 in the OTG Electrical Specifications (see Table 29-40).
Section 30.0 “Packaging Information” Updated the 64-Lead Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body [QFN] packing diagram.
Product Identification System Added the new V-Temp (V) temperature information.

INDEX

A

  • AC Characteristics ........ 161
  • Internal RC Accuracy ........ 163 AC Electrical Specifications
  • Parallel Master Port Read Requirements ........ 186
  • Parallel Master Port Write Requirements ........ 187
  • Parallel Slave Port Requirements ........ 185 Assembler
  • MPASM Assembler ........ 148

B Block Diagrams

  • ADC Module ........ 123
  • Comparator I/O Operating Modes ........ 125
  • Comparator Voltage Reference ........ 127
  • Connections for On-Chip Voltage Regulator ........ 138
  • Input Capture ........ 107 JTAG Compliant Application Showing
  • Daisy-Chaining of Components ........ 139
  • Output Compare Module ........ 109
  • Reset System ........ 87
  • RTCC ........ 121
  • Type B Timer ........ 37, 95, 105
  • UART ........ 115
  • WDT ........ 137 Brown-out Reset (BOR)
  • and On-Chip Voltage Regulator ........ 138

C C Compilers

  • MPLAB C18 ........ 148 Comparator
  • Operation ........ 126 Comparator Voltage Reference
  • Configuring ........ 128
  • CPU Module ........ 31, 37
  • Customer Change Notification Service ........ 209
  • Customer Notification Service ........ 209
  • Customer Support ........ 209

D

  • DC Characteristics ........ 152
  • I/O Pin Input Specifications ........ 157
  • I/O Pin Output Specifications ........ 158
  • Idle Current (I$_{IDLE}$) ........ 154
  • Operating Current (I$_{DD}$) ........ 153
  • Power-Down Current (I$_{PD}$) ........ 155
  • Program Memory ........ 159
  • Temperature and Voltage Specifications ........ 152
  • Development Support ........ 147

E

  • Electrical Characteristics ........ 151
  • AC ........ 161
  • Errata ........ 19

F

  • Flash Program Memory ........ 85
  • RTSP Operation ........ 85

I

  • I/O Ports ........ 101, 115
  • Parallel I/O (PIO) ........ 102
  • Internet Address ........ 209

M

  • Microchip Internet Web Site ........ 209
  • MPLAB ASM30 Assembler, Linker, Librarian ........ 148 MPLAB Integrated Development Environment Software .. 147
  • MPLAB PM3 Device Programmer ........ 150
  • MPLAB REAL ICE In-Circuit Emulator System ........ 149
  • MPLINK Object Linker/MPLIB Object Librarian ........ 148

P

  • Packaging ........ 191
  • Details ........ 192
  • Marking ........ 191
  • PIC32 Family USB Interface Diagram ........ 100
  • Pinout I/O Descriptions (table) ........ 22 Power-on Reset (POR)
  • and On-Chip Voltage Regulator ........ 138

R

  • Reader Response ........ 210

S Serial Peripheral Interface (SPI)... 87, 97, 111, 119, 121, 130

  • Software Simulator (MPLAB SIM) ........ 149
  • Special Features ........ 131

T

  • Timer1 Module ........ 89, 95, 103, 105 Timing Diagrams 10-bit Analog-to-Digital Conversion (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000) .. 183 10-bit Analog-to-Digital Conversion (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111,
  • SAMC<4:0> = 00001) ........ 184
  • I2Cx Bus Data (Master Mode) ........ 175
  • I2Cx Bus Data (Slave Mode) ........ 177
  • I2Cx Bus Start/Stop Bits (Master Mode) ........ 175
  • I2Cx Bus Start/Stop Bits (Slave Mode) ........ 177
  • Input Capture (CAPx) ........ 169
  • OC/PWM ........ 170
  • Output Compare (OCx) ........ 169
  • Parallel Master Port Write ........ 186, 187
  • Parallel Slave Port ........ 185
  • SPIx Master Mode (CKE = 0) ........ 171
  • SPIx Master Mode (CKE = 1) ........ 172
  • SPIx Slave Mode (CKE = 0) ........ 173
  • SPIx Slave Mode (CKE = 1) ........ 174
  • Timer1, 2, 3, 4, 5 External Clock ........ 167
  • Transmission (8-bit or 9-bit Data) ........ 116
  • UART Reception with Receive Overrun ........ 117 Timing Requirements
  • CLKO and I/O ........ 164 Timing Specifications
  • I2Cx Bus Data Requirements (Master Mode) ........ 175
  • I2Cx Bus Data Requirements (Slave Mode) ........ 178
  • Output Compare Requirements ........ 169
  • Simple OC/PWM Mode Requirements ........ 170
  • SPIx Master Mode (CKE = 0) Requirements ........ 171
  • SPIx Master Mode (CKE = 1) Requirements ........ 172
  • SPIx Slave Mode (CKE = 1) Requirements ........ 174

V

  • VCORE/VCAP Pin ........ 138
  • Voltage Reference Specifications ........ 160
  • Voltage Regulator (On-Chip) ........ 138

W

Watchdog Timer

  • Operation ........ 137
  • WWW Address ........ 209
  • WWW, On-Line Support ........ 19

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  4. What additions to the document do you think would enhance the structure and subject?

  5. What deletions from the document could be made without affecting the overall usefulness?

  6. Is there any incorrect or misleading information (what and where)?

  7. How would you improve this document?

DS61143H-page 212 © 2011 Microchip Technology Inc.

Product Identification System

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Microchip Brand PIC32
Architecture MX
Product Groups 3XX
Flash Memory Family F
Program Memory Size (KB) 512
Pin Count H
Tape and Reel Flag (if applicable) T - 80
Speed I / PT - XXX
Temperature Range
Package
Pattern

Examples:

  • PIC32MX320F032H-40I/PT: General purpose PIC32MX, 32 KB program memory, 64-pin, Industrial temperature, TQFP package.
  • PIC32MX360F256L-80I/PT: General purpose PIC32MX, 256 KB program memory, 100-pin, Industrial temperature, TQFP package.

Flash Memory Family

Architecture MX = 32-bit RISC MCU core
Product Groups 3XX = General purpose microcontroller family4XX = USB
Flash Memory Family F = Flash program memory
Program Memory Size 32 = 32K64 = 64K128 = 128K256 = 256K512 = 512K
Speed 40 = 40 MHz80 = 80 MHz
Pin Count H = 64-pinL = 100-pin
Temperature Range I = -40°C to +85°C (Industrial)V = -40°C to +105°C (V-Temp)
Package PT = 64-Lead (10x10x1 mm) TQFP (Thin Quad Flatpack)PT = 100-Lead (12x12x1 mm) TQFP (Thin Quad Flatpack)MR = 64-Lead (9x9x0.9 mm) QFN (Plastic Quad Flat)BG = 121-Lead (10x10x1.1 mm) XBGA (Plastic Thin Profile Ball Grid Array)
Pattern Three-digit QTP, SQTP, Code or Special Requirements (blank otherwise)ES = Engineering Sample

Figure from the manual

Worldwide Sales and Service

AMERICAS

Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/support
Web Address:
www.microchip.com

Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455

Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088

Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075

Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643

Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924

Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260

Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453

Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608

Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445

Toronto
Mississauga, Ontario, Canada
Tel: 905-673-0699
Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431

Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755

China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104

China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889

China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500

China - Hangzhou
Tel: 86-571-2819-3180
Fax: 86-571-2819-3189

China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431

China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470

China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205

China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066

China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393

China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760

China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118

China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256

China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130

China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049

ASIA/PACIFIC

India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123

India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632

India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513

Japan - Yokohama
Tel: 81-45-471-6166
Fax: 81-45-471-6122

Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302

Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or 82-2-558-5934

Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859

Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068

Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069

Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850

Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370

Taiwan - Kaohsiung
Tel: 886-7-213-7830
Fax: 886-7-330-9305

Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102

Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350

EUROPE

Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393

Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829

France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79

Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44

Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781

Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340

Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91

UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820

05/02/11

Figure from the manual

Text converted from the manufacturer's document. A □ marks a character that could not be read in the original. Back to the Microchip PIC32 discussions