I have an audio amp in a 20-pin DIP, and pins 11-20 are all grounded; the datasheet says to hook them to a large area of copper as a heat sink. My PCB design software leaves an annulus around each pad in a ground plane, connecting the pad to the plane with a "+" trace. The manual says that's a "thermal" connection, and that if you put copper all the way around, the thermal conductivity away from the pin is so high that you can't solder it.
How hard is it, really, to solder something like that? If I'm trying to take heat away from the chips, then a full connection sounds like what I want. But if I can't solder it, I'll be an unhappy camper.
dhm.