To be fair, I indicated that the OP should post more detailed info ( which certainly needn't have encroached on an NDA ) or 'shut up'.
It seems that you too have come to the same conclusion that the enclosure in which this IC is to be installed is the limiting factor.
I despair sometimes at the poor level of practical skills in engineering exhibited today - and especially by 'academics'. A basic understanding of heat flow would have fixed this.
Something this simple should have been considered at the beginning. Leaving ' thermal manageent ' to the end is begging for failure. And sadly it looks like failure is the conclusion here.
Graham