Re: Gold plating the entire PCB

That has nothing to do with it, dipshit.

Strike two! SILVER is the best conductor. Gold and Platinum have the best oxidation characteristics, hence their use on contacts.

I think you're an idiot. Every circumstance is different, so "normally" doesn't ever apply.

"You're told"? Whom is it handing you this horseshit? There are REAL numbers. We typically measure these things in micro-inches.

Wow. You actually remembered something correctly.

You might have a little experience in this realm, but I still have my doubts.

You just make s*it up as you go all the time? EVERY PCB situation is different.

HASL hasn't been used in years. Even solder plated PCB assemblies have SMOBC treatment these days.

HASL is very often used on SMOBC boards.

Hey, are you DampMatter/AlwaysWrong? Sounds like his style.

John

Look at the headers and you'll see his IP address, 72.197.139.29 so it is dimmie.

It is interesting that you say the above and then: [....]

You you are saying that gold is a reliability problem and recomended. What gives?

Of course it's Dimbulb.

NNTP-Posting-Host: 72.197.139.29

Consider the edge of the solder joint where it meets the rest of the (unsoldered) gold-plated trace. What is the percentage of gold at that thin edge? Hint; the saturation point og gold in solder.

Is that really where you want embrittlement?

Has anybody figured out who he works for?

John

OK, I'm considering it. (........) Done.

Why would one tiny brittle sliver matter?

John

FWIW, it looks like his isp is Cox:

$ nslookup 72.197.139.29 Server: 10.0.0.1 Address: 10.0.0.1#53

Non-authoritative answer:

Authoritative answers can be found from:

It's the thickness of the gold layer. Supposedly, immersion gold layer is thin enough (

You forgot to take your meds. Dose up and re-read.

I guess it depends on whether you want to avoid a crack there. Such a crack would be across the trace, and could propagate into the underlying copper, causing an intermittent open.

...but only if the entire gold surface is wetted by solder. This is not the case if you gold plating the entire PCB. Also, after the gold is dissolved, the solder has to wet tin, not copper.

Doesn't sound frightening to me. The brittle area will be not very many microinches in extent. If it does fracture - very unlikely, given the big soft pad and soft copper all around - it's no worse than a tiny scratch on a trace. I've never heard of a small scratch propagating. Copper is nice soft stuff.

Anyhow, I've never heard of this happening. Have you?

John

Why do you care, LarkinTard?

You obviously have no clue what terms like "mission critical" refer to.

Would you not be upset if the failure of such a connection was the cause of a catastrophic failure of a system that caused the death of the person it failed on?

It is also a problem for gold plated terminals that have solder cups on the wiring side. The cups are plated just as thick as the terminal contact is, and that is far too much gold, as you indicated earlier.

For mil solder cups that are gold plated (most), we have to add solder, and then evacuate it... twice... with copper solder braid, then a proper solder joint can be constructed. Otherwise, one gets a bad solder joint, due to Gold Intermetallic Embrittlement.

Just curious. Whoever it is seems to be 10 or 20 years behind current technology.

John

Hahahahaha... That's damn funny.

More like industry leaders.