I'm having trouble getting a handle on how to solve (or at least estimate) this...
Suppose I have a box constructed of 1/2" plywood, inside dimensions 4" x 4" x 10", and I dissipate 1W inside the box, what will the temperature rise be? ...Jim Thompson
-- | James E.Thompson | mens | | Analog Innovations | et | | Analog/Mixed-Signal ASIC's and Discrete Systems | manus | | San Tan Valley, AZ 85142 Skype: skypeanalog | | | Voice:(480)460-2350 Fax: Available upon request | Brass Rat | | E-mail Icon at
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| 1962 | I love to cook with wine. Sometimes I even put it in the food.
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| James E.Thompson | mens |
| Analog Innovations | et |
| Analog/Mixed-Signal ASIC's and Discrete Systems | manus |
| San Tan Valley, AZ 85142 Skype: skypeanalog | |
| Voice:(480)460-2350 Fax: Available upon request | Brass Rat |
| E-mail Icon at http://www.analog-innovations.com | 1962 |
I love to cook with wine. Sometimes I even put it in the food.
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Best regards,
Spehro Pefhany
Amazon link for AoE 3rd Edition: http://tinyurl.com/ntrpwu8
Microchip link for 2015 Masters in Phoenix: http://tinyurl.com/l7g2k48
Temp rise = power * thickness / (conductivity * area )
Temp rise = 1 W * 0.0127 m / (0.13 * 0.124) = 0.79 K
Buuuttt, when I looked up the thermal conductivity of plywood I found values ranging from 0.12 and 0.17 W/m-K. The construction of plywood varies a lot, so the temperature rise can vary a lot.
That's the temp. drop across the plywood only. Don't forget thermal resistance from load to plywood, and plywood to ambient (if we're after temp rise of the load).
The right answer involves laminar flow approximation and the Nusselt number.. maybe there is a calculator out there. I think I would just calculate the effect of the four vertical walls and leave it at that for an upper bound.
It won't be much though for something ~5" cube. I'd guess a few degrees C total.
--sp
--
Best regards,
Spehro Pefhany
Amazon link for AoE 3rd Edition: http://tinyurl.com/ntrpwu8
Microchip link for 2015 Masters in Phoenix: http://tinyurl.com/l7g2k48
--
Best regards,
Spehro Pefhany
Amazon link for AoE 3rd Edition: http://tinyurl.com/ntrpwu8
Microchip link for 2015 Masters in Phoenix: http://tinyurl.com/l7g2k48
We often do thermal breadboards. Cardboard chassis mockups, fans, heat sinks, resistors, duct tape, whatever. Fiddle to optimize. Air flow is especially hard to model. It's fun to build stuff.
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John Larkin Highland Technology, Inc
lunatic fringe electronics
That fine old tradition is the reason old (Cray-1?) supercomputers used three kinds of chips. A gate, a flip-flop, and a dummy chip. All the airflow cooling was designed for each board to be the same size, with a regular grid of component ICs... So if you didn't need M x N chips for the board's function, it was filled in with dummies.
So the inner wall temperature is 0.9 degrees above the outer surface wall.
0.6 + 0.9 = 1.5 degrees above external ambient.
Internal air is going to be somewhere close. Temperature difference between internal air and the internal wall are roughly the same, as the internal air represents a limited source that is responsible for surface temperature, rather than some infinite sink, but there may be some kind of penalty for the transfer.
Temperature of the source's surface temperature will depend on its size.
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