Nanoamp calibrator again

May 31, 2012 49 Replies

But that's too simple :-)

Regards, Joerg http://www.analogconsultants.com/

It's not about being able to *build* the board. It's about testing, standards, reliability, and all that stuff you keep pretending others don't have to deal with.

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Getting the quality control department to cope with something new isn't the easiest part of development engineering, but it's an unavoidable aspect of the job.

-- Bill Sloman, Nijmegen

Huh? What pretending? We simply deal with all that. Have to, because much of my work is in very regulated fields.

If we were to listen to all the balking we'd still be swinging from trees. My very first industry design project as an engineer in the mid

80's was completely SMT, huge board almost the size of a PC motherboard. Yes, there were discussions with the manufacturing and QC folks but then they rolled up the sleeves and did it. We even started our own reflow line because nobody in the area dared to take on that contract, for years. [...]
Regards, Joerg http://www.analogconsultants.com/

Read what I wrote again.

Read the thread again. It's not balking, so much as there *ARE* problems that haven't been overcome. There are all sorts of standards that go by industry. Other industries have standards, outside pharma and aero. Some are controlled by customers, rather than the fed, but that doesn't mean that anything goes.

I never pretended anything. I know that others will have to deal with the same stuff we had to deal with. So? If they don't then they risk being left behind in technology. Which happened to a competitor of ours which then stopped being a competitor.

Like what?

In those areas it's even worse. Have you disected a cell phone lately?

Regards, Joerg http://www.analogconsultants.com/

:-)

Huh?

Temperature extremes, flex, vibration, you name it. The specs are pretty stringent and AFAIK, nothing below a 0402 is certified to work. We have the same problems with fine-pitched BGAs. Anything less than .8mm causes much grief (like daughterboards, just for the BGA, etc).

Other than some shock, call phones have an easy life.

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Whatever. I don't know what you mean with me pretending anything, so no need for me to read old posts.

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One shall do proper dissipation calcs, always. Flex and vibration are obviously less of a problem with smaller parts. Else there would be more boardflex versions like there are for 1210 and up (because at such larger size that can be an issue on vehicles and aircraft).

What do you mean by "certified"? And how do you explain the presence of

0201 parts in critical gear if your above assertion were true?

Absolutamente. That is why I never use BGA if there is an alternative. And there always was. Placing a large not flexible part onto a naturally flexible FR4 substrate has always been a bad idea IMHO. As evicended by the field failures we all know about. Game boxes, laptops, etc.

But this has nothing to do with 0201 or 01005 parts.

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Constant fall on pavement, tile floors, people sitting on them, forgetting them on the dashboard in Arizona when it gets to 115F, leaving it in the car before the climb onto a glacier? Easy?

Regards, Joerg http://www.analogconsultants.com/

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Environmental. Dissipation has nothing to do with it.

Not so. There's less solder surface, too.

So are smaller devices.

Different markets, different requirements.

Same, but different.

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"Whether you think that you can, or that you can't, you are usually right." --Henry Ford

bonus quote:

"I am looking for a lot of men who have an infinite capacity to not know what can't be done."

--Henry Ford

-- Cheers, James Arthur

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