Hi guys, I have to produce a PCB with a couple of FPGA on it and I was wondering if the solder mask right under the FPGA would prevent a good heat dissipation (provided that we will put the thermal paste underneath). Some of our designers suggested that the gain you have in heat dissipation you will loose it in short-circuit problems on the mounting, through the via underneath which are much more of a pain. Could you give me any suggestion?
Thanks a lot
Al