The packages were the same. What made the difference is the width of the external data bus.
The packages were the same. What made the difference is the width of the external data bus.
Which primarily impacted price through the attached devices rather than the CPU itself.
Exactly. We made one of the very first applications with an 80188. I still have kept the prototype processor, one of the very first arriving to this side of the Pond, marked ESC for Engineering Sample series C.
No, the die was the same. The bond-out determined which it became. At least they started out that way. There may have been optimizations later.
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