Chip (wafer) bonding proccess.

How does bonding machines make wires between the package pins and chips to attach ..?

Reply to
pbdelete
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You can probably find online descriptions. That aside, there's a combination of ultrasonic vibration (scrubbing) and heat applied to the wire fed through a small ceramic capillary tube. The resulting metal/metal bond is pretty strong.

Reply to
John_H

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