Hi,
I have been designing boards for myself for quite awhile BUT I am using a mechanical etch process to fabricate them on an IBC2222 BoardMaker machine. This process is quite different than going to a vendor. My day has finally arrived that I have to rely on a vendor to produce some one off boards for me. I have read the David L Jones document available on the web but I still have a few questions I am hoping that I can get some help on so here goes......
1.) How are non-plated thru holes handled? Do they still require a pad ring to allow the plate thru process to work and then they get drilled to the finished size.
2.) My CAD system is lacking in area fill capability. Do the PCB vendors allow using a combined layer negative for the fill.planes and combining it with a positive artwork layer to get the connections in. Same goes for ground plane layers, do the vendors accept them as negatives?
3.) What are typical clearances for solder mask artwork? Can the openings go right up against the edge of pads? Can this artwork be a negative too?
4.) How do I define the cut-out shape as the boards are circular so a simple shear cross hairs in the corners won't do it. Do I provide a layer with the shape to be cut-out?
5.) I require countersunk mounting holes around the periphery. How to I indicate that? Would it be a see Note ### for more information?
Many thanks to all who are able to help me out.
regards, al