Hi,
I've just upgraded Eagle to the non-profit license, so I can now (in theory :-) do 4-layer boards.
- If I have a ground layer and I have one part as an analogue ground plane and another as a digital ground plane (two adjacent rectangles) how and where should they be connected?
- Given that I have a ground plane, should I still do copper pouring in the signal layers (and connect them to ground)?
- This probably isn't relevant for my first project (guitar-computer interface: differential signal, 192 kHz, 24 bit ADC with pre-amp and USB/FW), but which is the cleaner solution for, say, a single signal crossing: 2 vias with a trace on the bottom signal layer, or a zero ohm SMD with the other signal passing under it?
- One of the circuits I am copying/modifying has a 1uF / 63V electrolytic decoupling capacitor (directly in the signal path) before any amplification. Wouldn't a plastic (polyethyleneterephthalate) one be better, from a noise point of view?
- Is it OK/possible/desirable to place a via on an SMD pad (e.g. for resistors & capacitors to ground)?
- I suppose it's better not to route signals underneath opamps (from a noise point of view)? What if the path then has to become a fair bit longer? Is there a rule of thumb here?
Thanks for any answers!
colin