Hello all,
I have a question regarding the layout of a BGA packaged FPGA. For the first time I am using multiple ground planes, and I am curious if when routing the ground balls from the BGA package, do I need to have a via that attaches to both ground planes, or is having it attach to one plane directly under the package enough, as long as there are vias elsewhere that tie the two planes together. I would ideally like to use blind vias for the BGA layout so I can get components on the underside of the PCB as well without any through hole vias getting in the way. My satckup is as follows:
1 - signal/components 2 - ground plane 3 - signal 4 - signal 5 - power plane 6- ground plane 7 - signal 8 - signal 9 - power plane 10 -signalI was planning on mounting the caps underneath the BGA package on the underside, again using blind vias so there is more room for signal routing, but I'm considering mounting them around the package on the top side now.
100 MHz is the highest frequency signal anywhere on the board, and most signals are 50 MHz speed (or there abouts).Any comments would be greatly appreciated.
Thanks,
Jason
jberringerNOSPAMatNOSPAMsympatico.ca (remove NOSPAM)