I have a small 480v 5w flyback power supply that has had a large number of field failures. In general the failure rate is about 0.4%, one out of 250 units. This I can live with. One particular customer in Northern California has had a 25% failure rate. Most of the units come back filthy so that there may be an environmental aspect to the problem as well. I think units are in an air stream which may be blown in from a rooftop intake. We have beat the crap out of the power supplies here at the factory and have not been able to kill them. Heated transistors to 150c, put 1500v dc on the supply, etc and they keep on running. I am begining to think there may be a stress related problem with the lead bend. Production is bending a complete 90degree at the drain lead of the mosfet directly at the package. It looks like the package ruptures and sends plasma out and destroys the clamp diodes and control chip and so forth. Destruction is very complete here.
So question is then - has anybody ever heard of failures related to this type of handling? I will contact mosfet vendor after discussing here.
thanks, Bob