Hi,
I'm looking for some guidelines regarding replacement/substitution of obsolete components in our products.
Currently the procedure is as follows: Passive components are evaluated by datasheet, and replaced without testing in case of matching data.
Semiconductors are evaluated by datasheet, and tested in 5 pcs. of the product.
The test is a standard functional production test, which basically consists of a verification of the functionality; signal levels, band widths, memory addressing etc. No temperature cycling, EMC test or burn in is performed.
My worry is, that you in case of e.g. a die schrinked SRAM or uP, you might reduce your margin to an unacceptable level, making the product more sensible to EMC, temperature or what ever...
How is this qualification done in the industry? E.g automotive?
Thanks
Jesper