Hi all,
>
>I'm not sure this is the good place where to post this, please advise a
>better NG in case it exists.
>
>I'm working on the soldering process of a component with phosphor bronze
>pins onto a fairly standard FR-4 multilayer PCB. The component is a
>light detector (MPPC: Multi Pixel Photon Counter) and I still do not
>know what is the amount of heat to deal with.
>
>Is there any recommendation on soldering this components on a pre-tinned
>pad?
>Anything special on thermal behavior which should be considered? For
>instance I have seen a power mosfet mounted without stress release on
>the soldering point on a the thru-hole one-sided pad that after several
>ON/OFF cycles caused the joint to crack.
This is a pretty low volume group. You are likely to have better luck over in sci.electronics.design, so I'll cross-post over to there. There are some photon pushers that hang around s.e.d regularly, as well as numerous designers and prototype builders who might have experience with a similar part.
Of course, if there's a specific part number or datasheet link that you could post, that would help to narrow the focus.
(Follow-ups set to s.e.d)