:On Thu, 05 Nov 2009 22:37:53 -0600, Vladimir Vassilevsky : wrote: : :>
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:>Ross Herbert wrote: :>
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:>> One thing you need to remember.. if there are any heat generating components on :>> the board, encapsulation in a hard compound may cause subsequent fracturing of :>> components or solder joints because they can't expand and contract. :>
:>I know an engineer who spent many years mixing different compounds and :>fillers trying to create solid substance with minimal expansion or :>contraction while it is cured, and which will not rip the components off :>the PCB because of thermal effects. This is no simple problem. :>
:>
:>Vladimir Vassilevsky :>DSP and Mixed Signal Design Consultant :>
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: : : Quite simple. Conformal coat the PCB prior to potting. : : Still getting breakage? Conformal coat... twice. Make a blanket.
It is far simpler and more effective to simply dip the whole board in pourable silicone rubber prior to encapsulation with the hard epoxy. That will leave plenty of room for expansion.