Due to it's single offset mounting screw, TO220 is a notoriously poor package, if a predictable mechanical or electrical interface to the entire mounting surface area is required. Clamps are usually required to distribute mounting forces equally across the mounting surface.
For direct soldering, you should follow the recommended reflow soldering profile provided by the mfr. If a large heatsink is involved, maintaining this profile will require extreme controller energy inputs due to the specific heat of the heatsink material's mass.
Soldering the devices to smaller intermediate structures that DO offer reliable mating to a heatsink is usually more practical, as is demonstrated in most higher-powered commercial semiconductor modules.
Without soldering, both thermal and electrical contact to aluminium or other hard copper can be improved marginally by introducing soft copper foil stock. Alternately an intermediate soft copper sheet can be introduced for direct electrical pick-off. Passivation of the surface of the copper is required to reduce oxidation in service.
This will not overcome the physical problems of TO220.
RL