I have recently conducted some research on binding SMD components with glass and ceramic substrates using pure indium and indium alloys. The results are very satisfactory, and the technique may find some applications in HV and high power density solutions. One can directly solder a MOSFET to a ceramic heatsink or a string of HV resistors to an insulating glass plate without prior metalisation.
The only thing to improve is the initial wettability. Do you happen to know of any tips regarding the composition of the alloy or the preparation of the substrate?
Will indium bind to AlN? I have no sample to perform a test.
Best regards, Piotr