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Chinese IC Farmers?
Oct 17, 2009
3 Replies
I can see this would be useful for failure anaylsis as well.
Cheers
Funny that it doesn't mention the speed of the decap process. I'm guessing a laser nibbles at the package. It could be pretty slow.
Most methods of removing epoxy packaging are pretty slow. Particularly if you want to retrieve the device without further damage.
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