Make that the 3081. The 3033 was card-on-board, essentially a 3168 remapped into MS-255 (about 25 gates per 1/2" sq. module) on ~6"x8"
8-layer cards. The 3081 was the first to use TCMs, with 100ish chips mounted on a 4"x4" alumina substrate, which was then attached to a ~4" cube heat exchanger (a.k.a. "brick"). Though the 3081 was designed before the 3033 (an 18-month wonder), it came out a couple of years later.Each of those 100 layers was punched individually, traces laid down, and then fired. The firing caused the substrate to shrink something like 10%. I was constantly amazed that it worked.