Hello,
I am trying to prototype a circuit which uses a TI LMP91000 IC. The IC is a tiny WSON package and I'm unsure how to go about making a prototype PCB for it.
Can standard UV photoresist and etching methods be used?
I have access to an oven for surface mount devices. Does a stencil need to be created to apply the solder paste? The pin/pads under the IC are very tiny.
The adapters I have seen to convert WSON to DIP are far too expensive.