Hello,
I am trying to prototype a circuit which uses a TI LMP91000 IC. The IC is a tiny WSON package and I'm unsure how to go about making a prototype PCB for it.
Can standard UV photoresist and etching methods be used?
I have access to an oven for surface mount devices. Does a stencil need to be created to apply the solder paste? The pin/pads under the IC are very tiny.
The adapters I have seen to convert WSON to DIP are far too expensive.
Sure, they make the ICs themselves with very similar resist and processes.
Yes, you need a stencil to get the right amount of paste in the right spots. Expect a LOT of tests before you get anywhere near reliable soldering. I worked with a WS package a while ago and had insane difficulty with solder bridges under them chips. I redid the board with an SSOP-type package and that worked vastly better.
Jon
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