and why? I recently saw some printed advertising copy, including this statement concerning BGA chips "We safely remove the existing lead-free solder balls and replace them with SnPb "
cannot find reference to that on their site, just
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BGA Reballing (Lead Free / 63-37 / High Melt Ceramic Packages) $1/2 million investment in a unique technology has allowed Retronix to reball BGA and uBGA devices without inducing a thermal cycle (mass reflow), which can damage the integrity of the device. We use a laser energy pulse which attaches the solder spheres individually to the pad in less than
20m/s. The bonding of the sphere to pad in this short time does not allow heat dissipation into the silicon die, therefore offering a safe alternative to mass reflow. The equipment shown is contained within a clean room environment, supplemented by laminar flow hoods and a nitrogen chamber for the reballing process. We can process sphere sizes from 760 microns down to
100 microns.