maximum
You can btw see this in many 'CPU cooler' designs. However it can cause dust and fluff to collect.
Yes I can believe that. It would help cause the 'turbulent airflow' effect. I first learnt about this around 30 years ago from data supplied by the IERC heatsink company and have widely used the technique ever since with measurable success.
You see with purely vertical or horizontal fins widely spaced, the air going 'up the middle' between them never actually extracts much useful heat. You need to get the airflow to 'mix' to get the best effect.
Within reason, the fins don't need to be that thick at all. Their minimum width is normally a limitation of the extrusion technique. What's best it have lots of them, consistent with not creating a dust trap by having them pitched too fine..
Don't make the fins TOO convoluted as this will actually impede airflow. I have my own 'proprietary' technique that avoids any need to twist the fins which most people would find counter-intuitive but in a calibrated test produced a 20% improvement in thermal resistance with a lower weight of aluminium in 2 (superficially to the casual viewer) identical designs.
As it seems no-one has yet twigged my method, I'm reluctant to give away my 'secret'.
As for the 'plate' its needs to be thickest near the devices and can taper further out. Thermal resistance calculation are little different to electrical resistance after all.
Graham