Another PbF indicator?

Jan 24, 2011 4 Replies

On a recent "American" board , made in China, so no warning legends of PbF . Don't know what its called, the sort of conformal coating final process at the pcb production phase is a staining coat , usually green these days. White rings showing around the solder pads after soldering may show elevated soldering temperature has been used or wrong composite material body , showing rings of plain white polyester+fibre board . The green staining having melded into the plastic or evaporated.



From UL 6 digit E number and board type this is designated 260 deg C / 10 second solder dwell ( for conventional soldering) rather than 270 deg / 10 second dwell of proper made for PbF pcb boards.


If anyone knows the significance of 288 degree C / 8 second soldering dwell time pcb +soldering rating in comparison to 260/10 and 270/10, I would be interested to hear.

IPC-TM-650 Test Method 2.4.24.1. would seem to be the test, should anyone be interested Time to Delamination (TMA Method)

10 second solder float
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Wrong tests , more likely this test, as seconds not minutes, peel strength not delamination

Solder float peel strength: (no change after 288C/10 sec) eg

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$File/2006_PCB_Damage_Test_Plan.pdf

So I reckon the ul.com pcb classification is this test

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with 10 second solder float for the heating stage Then passing 260 degree C for leaded solder use

270 deg C for PbF 288 deg C for high spec like polyimide/ N7000-1 /Pyralux

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