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Xilinx V4 & DDR2 Memory Interface

i'm designing a board with a Xilinx XC4VFX12-11SF363C and DDR2 memory components following the design used in Virtex-4 ML461 Memory Interfaces Development Board User Guide [ug079].pdf as a general guideline the question i have is regarding the signal termination for the bidirectional signals the guide recommends FPGA Driver Termination at FPGA Termination at Memory

SSTL18_II 50 ohms pull up to 0.9V 50 ohms pull up to 0.9V

but one could also use

FPGA Driver Termination at FPGA Termination at Memory

DIFF_SSTL_II_18_DCI No termination 50 ohms pull up to 0.9V

so i can save placing the required pull up resistors near the fpga

but if the memory components are close to the fpga

can i safely remove the memory component pull up resistors?

thanks

enzo

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Reply to
Enzo Guerra
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Enzo,

You need to run a signal integrity simulation to answer your question.

Austin

Reply to
austin

Enzo -

DDR2 SDRAMs have something called on-die termination, or ODT. Each DQ and DQS line has a Thevenin terminator that can be enabled during writes; if the DIMM has two ranks of SDRAMs, you'll have two lines. You'll need a timing signal(s) to enable/disable ODT, but you should be able to dispense with discrete terminations at the DIMM.

Of course, it always pays to simulate.

Bob Perlman Cambrian Design Works

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Reply to
Bob Perlman

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