as ISE crashed so far I dotn have any reports, but from my thumb guess I would say you need at least as much as for LEON3 or more. LEON3 can be fit to S3-400, but for real work s3-1000 or larger is recommended so the same applieas to srisc as well. meaning there are no suitable Xilinx FPGAs in non-BGA to answer your question.
I think biggest non-BGA packaged RAM FPGA would be some Cyclone in PQ240 and biggest non-BGA if non volatile are counted is Actel, I think they offer all FPGA also the largest in PQ208.
It would be nice of course if Lattice XP2 would have large non-BGA devices, but that info want be available until Q4
Antti
J
John Adair
Uwe
We should have our Darnaw1 and Craignell1/2 products on release soon to offer easy prototype of Spartan-3E parts all the way up to XC3S1600E. Final check of them is on my current list of things to be done.
John Adair Enterpo> Antti Lukats wrote:
D
Derek Simmons
Being former employees of ST Microeletronics and from the size of the device, and the number of EPROM/RAM sockets I would hazard a guess that it is a INMOS (give credit where credit is due) transputer, T801 but not the standard TRAM module. Any body from the transputer recognize it?
Derek
ziggy wrote:
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