How to handle top-level glue logic.

Hi, there:

I have fixed module A (right) and reconfigurable module B & C(left), the clock buffers are all A's resource area. I need a local constant vcc_fake to control the BUFGMUX. However, my available IOs are only on the right-side of the FPGA, meaning the vcc_fake travels diagonally from the right-middle to the top-middle of the chip, and across the fixed module A's allocated area...

In active-module implementation, I found the routing of this vcc_fake between A and B/C are different now. What will happen in the final assembly? Which routing will PAR adopt in the final assembly?

Thanks for your advice. Kelvin

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kelvin8157
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