For the last ten years, I made HV PS designs, and most were merely two sided affairs, and we STILL used vias. Some had a few internal runs, and a few used internal runs for HV isolation purposes.
I do not recall any that were done via free, whether SMD or through hole, or mixed.
Hell, in through hole, we used SEVERAL redundant large PTHs to ensure good electrical conduction under high currents, and redundancy for same.
It was also a good practice to have a gang of four or six large vias under and around an SMD transistor placement to aid conduction cooling effects into the PCB media. Trust me, it does work.