Thanks, Lee.
Bob, You might forward this to your source. There already enough negatives associated with lead-free.
Harvey
--- Lee parker wrote:
Date: Sat, 19 Aug 2006 17:42:19 -0400 > From: Lee parker > Subject: Re: [LF] Silver Migration > To: snipped-for-privacy@IPC.ORG >
> Harvey >
> Prior to the introduction of immersion silver into AT&T (at the time) > extensive work was done to convince Telcordia there were no migration > issues. This work was presented at a SMT conference in 96 (I believe) by > George Wenger and Bob Furrow. The results were unambiguous; there was no > evidence of migration. >
> Best regards >
> Lee >
> J. Lee Parker, Ph.D. > JLP Consultants LLC > 804 779 3389 >
>
> ----- Original Message ----- > From: "Harvey Miller" > To: > Sent: Saturday, August 19, 2006 2:28 PM > Subject: [LF] Silver Migration >
>
> > Subject: Re: another dendrite question > > Date: Thu, 17 Aug 2006 12:44:29 +0100 > > From: John Woodgate > > Organization: J M Woodgate and Associates > > Newsgroups: sci.electronics.design > > References: > >
> > In message , dated > Thu, > > 17 Aug 2006, Jeff_M writes > > >I understand that to prevent silver migration between pads on a > circuit > > >board with a silver immersion finish it is necessary to have solder > > >mask between the pads. Is this true? How much solder mask? > >
> > I've seen silver migrate across 2.5 mm of a glass seal, with 5 V > driving > > it. Enough conductivity for the affected device to show as a > > short-circuit. > > -- > > OOO - Own Opinions Only. Tryformatting linkandformatting link> > 2006 is YMMVI- Your mileage may vary immensely. > >
> > John Woodgate, J M Woodgate and Associates, Rayleigh, Essex UK > >
> >
>
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