Hi guys -
First time posting here.
I'm doing some PC overclocking & have been finding my cpu pwr FETs are really sizzlin'! I don't have the equipment to get a temp reading, but several ppl on an overclocking forum I'm a member of, have already lost some motherboards due to blowing a FET. We're overclocking 1st generation Intel P4 Prescott cpu's, and they extremely power hungry. Some peeps have resorted to adding heat sinks to their FETs, with varying success.
I don't have the PN or datasheet handy; Sorry. They're 3P (S-G-D) power MOSFETS w/a high impedance gate.
I was wondering: Since the gate is a very high impedance, can MOSFETs be 'paralleled up' if they are identical components? IOW, I'm considering simply soldering an identical FET to the legs of the original FETs, in a pin-to-pin manner. This would be an attempt to loadshare using additional FETs.
It would seem to me the only concern would be if the device driving the gates can provide enough gate current for the original & additional FET, in each instance.
Anyone have any opinions???
TIA
Strat