Heatsinking a power component

Producing heat is the easy part:

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John

Reply to
John Larkin
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Yep, did that in one case. But this rapidly approaches economic limits where even considering the labor for mounting, the lone TO220 wins. Asian production assumed.

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Regards, Joerg

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Reply to
Joerg

That device has lots of capacitance. Are you switching at high frequency?

Reply to
Raveninghorde

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Do you mean gate-source? One gate driver chip per MOSFET (I am using two) seems to handle it just fine. This part is supposed to switch much faster than IRFS3206 (on paper, at least ;o) ) I made TO220 package out of the part (soldered it to the TO220 tab). Haven't figured out if it's better as the part seems to be misbehaving.

Reply to
mkogan

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