I am looking for information on causes and design guidelines for using thin FR4 between DC voltage potentials. I have a couple of data points that FR4 can have punch through and arcing at voltages far below the dielectric breakdown specified for the materials.
1.) 48 Vdc punched through 4-5 mils of FR4 within 6 months continual usage 2.) 35 Vdc punched through 0.4 mils of FR4 in about 630-650 hours 3.) FR4 type was not specified, but these are credible data points.This (in part) appears to be dielectric erosion exacerbated by Electro-migration of the copper traces/planes. More information would be great.
I am concerned by the data points because I am looking at ~125 Vdc on 4 mil thick FR4 and the product is expected to last 24x7x365.25x10 (613620 hours) minimum.
If any one could help, there doesn't seem to be a lot of information available. Thanks.