Hello Group,
This may not be the appropriate news group to discuss this, but the group helps me before and I do not know a better place to find help again.
As many, I am trying to build a low cost SMT Reflow Oven using an of the shelves small oven. I did have one first prototype working, but it was too small and plague with many problems, mostly cause by uneven heat diffusion.
I am working on s second unit, build with a lot more powerful heaters, cooling fan, and more evenly distribute heater surface. With this one, I have more than enough power to raise temperature to target value with the proper raise speed.
Not to say, that the unit is control by computer, PID is use to achieved proper temperature control. The PCB temperature is raise to 150c at a rate of 2c/second, the PCB soak at 150c for 60 seconds and it is raise to 215c at the same rate. Next temperature is cool down by a fan. Time over melting point (183c) is around 60 seconds has require by the paste we used.
The problem is that with those timing, we end up with a toasted PCB. Reducing the time over melting point, did correct the problem, but barely; the PCB still have trace of over heating. Trying the same process with RoHS paste, using a higher melting point temperature (220c), resulted in PCB burn up.
I tried to implement convection, but the blower is not powerful enough, it has no effect on the result.
I use a thermocouple in contact with the PCB to pick up temperature. I am not sure if I should monitor the air temperature at proximity of the PCB or still use direct contact? Both methods results in quite different temperature response.
Do you have any hints to the reason why the PCB toast? What is wrong with the method? Do I heat too quickly or too high?
I do over shoot a bit at the top, I should raise up to 215c, but end up at
225c for a few second before the fan turn ON, is this why the PCB have trace of over cooked? In the case of the RoHS paste, I must rise to 245c; I overshoot to 250c, but the PCB start burning well before I reach that temperature.I use standard fiberglass PCB. I must use and oven since I have SMT on both side. I did solder many PCB with the first prototype, but they must be small. The second unit will be able to older PCB up to 12" x 12", but I must find a way to prevent burn on the PCB.
Need help and suggestions.
Thank you all.
Jacques