Hi,
I am doing a mcu board. there are usb 2.0 high speed hub on the bottom and mcu analog circuits/dc-dc smps on the top layer. I want to do 4 layer top/gnd/pwr/bot but the usb 90/45ohm diff pair will be ruined because the diff pair trace is on the bot layer and the adjacent layer is pwr layer. Now I want to break the rule: partition the area underneath the usb hub circuits including the diff pairs on the pwr layer as ground and make the corresponding area on the gnd layer as
+3.3V usb power layer.will this be bad? I am creating a current loop? this will introduce much noise to the analog circuits? I worried too much about the
90/45ohm impedance for the usb high speed.I want to keep four layer for low cost, this is a homebuilt project.
Thanks....