Probably it's too small a die to make it worth trying to heatsink that hard.
John
Probably it's too small a die to make it worth trying to heatsink that hard.
John
Doubt it. I had to find just about every datasheet out there to get the correct pinout for a hundred of them. Fairchild packaging option to have the gate in the middle. No datasheet mentioned gate zeners AFAIK.
Thanks; even in this package,the substrate is the middle lead = = drain. And like i asked before,why the big eM-fah-sis on the D-pak package whenit is clear that no version of this part gets to play house with the D-pak?
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