Been experimenting with cutting PCB traces out of copper tape using a drag blade on my little CNC machine. The cuts themselves look decent, traces down around the half millimeter mark, but when I go to peel away the copper between the traces it just shreds. Instead of lifting out in one piece it rips into tiny bits and half the time it pulls up the trace I'm trying to keep.
I'm wondering if the issue is the tack of the tape backing. Mine is pretty aggressive and stuck down hard on the film, so the weeded copper has nothing holding it together as it comes off. Would a weaker adhesive tape help, or is it more about cutting depth? I suspect my blade is kissing the backing layer in places, which would glue the waste copper down in random spots and cause exactly this kind of tearing.
Also curious how people handle the corners. Mine come out razor sharp and I think that's where most of the rips start. Is there a way in typical cutting software to round the path slightly at every turn, or do people just redraw the traces with curves built in? Feels like there's a trick I'm missing here.