I discovered this via needing to isolate Vcc of a SOIC where the trace is under the IC and a multilayer board. I have a reel of 0.08mm diameter tungsten wire , tungsten probably not critical and diameter only needs to be small enough to go under SOIC pins. I've since tried, pin by pin, of an 8p SOIC on a scrap board with a success rate of 8 out of 8 isolating each pin , first time. Leaded solder, PbF situation not tried yet
Feed length of the wire under a pin , long enough to grab hold of both ends. Pull outwards and slightly upward while quick soldering iron melt of the pin solder. The wire pulls through, but surprisingly , 8 out out
8 times so far, the solder has not rejoined across the gap. Then a sliver of mica under the pin , in my Vcc situation, to fully isolate for testing purposes. But of course where hot air is out of the question , the IC is required for salvaged re-use etc, this method pin by pin could be used even in restricted space, to salvage a whole SMD IC. I wonder if a single loop per side of a DIL or quad footprint IC , and progressive single pin melting , would work with 8 or more pins in one operation - worth trying some time