I always start by separating symbols and footprints in my head. The way to make library work efficient is to treat symbols as the conceptual part and the footprints as the geometric implementation. For things that are standard integrated circuits like SOIC or QFN, I rarely draw them from scratch or download them from third-party sites. I lean heavily on the internal database provided by the software. If I need a specific variation that isn't listed, I usually use the automatic generator for that package type instead of trying to find a perfect match from elsewhere. This saves tons of cleanup time with pad names and silkscreen issues.
When a new component arrives that isn't a standard package, my process is usually to copy the closest available footprint and then verify the specific dimensions and pin count using the datasheet. If I am dealing with complex connectors or custom headers, I might spend an hour or two drawing the footprint manually. However, I’ve seen some developers start feeding the datasheet PDF into newer AI tools to generate basic footprints, which is fast. But even those outputs need a careful visual check to make sure the geometry is correct before committing them to the library.
As for consistency, there is definitely a standard path to follow, especially for pin naming and power plane grouping. It isn't just about personal habit. Following the official IPC standards or using the conventions set by the KiCad maintainers keeps your files organized and easy to audit later. Changing your personal conventions every few months is what leads to that alien feeling with your older designs. Pick one logic and stick to it. In terms of time, a basic footprint for a common device takes me minutes, assuming the package type is already in the library. A new component for which there are zero existing footprints takes about an hour start to finish, including the necessary 3D model check. The trick isn't avoiding the work entirely, but maximizing the use of pre-existing templates and standardized naming schemes.